ATS-15E-153-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-15E-153-C1-R0

Thermal – Heat Sinks

Heat sinks are cooling devices that are designed to dissipate heat from an electronic component or device. ATS-15E-153-C1-R0 is a type of heat sinks that are used to provide cooling for integrated circuits and other micro components. This is one of the most efficient and reliable types of heat sink available on the market today.

Application Field of ATS-15E-153-C1-R0

The ATS-15E-153-C1-R0 heat sink is mainly designed for cooling electronic components that are at risk of overheating. Electronic components that are prone to heat-related problems such as integrated circuits, power transistors, voltage regulators, and transformers are all suitable for this type of heat sink. The ATS-15E-153-C1-R0 also has a high thermal conductivity which makes it extremely efficient at cooling even the most heat-sensitive components.

Working Principle

The working principle of the ATS-15E-153-C1-R0 is based on the use of a heat transfer fluid. This fluid helps to absorb the heat generated by the electronic component or device and transfer it to the fins on the heat sink. With its high thermal conductivity, the heat is dissipated quickly from the fins and the temperature of the electronic component is lowered.The ATS-15E-153-C1-R0 also features a patented thermal integrated interface (TIF) design that ensures that heat is spread evenly across the heat sink fins. This maximizes the heat dissipation and helps to reduce temperature hotspots. Additionally, the aluminum fins on the heat sink helps to further promote optimal heat dissipation and cooling performance.

Conclusion

The ATS-15E-153-C1-R0 heat sink is an efficient way to keep electronic components from overheating and helps to ensure that they remain working at optimum levels. Its patented thermal interface design ensures that the heat generated by the components is efficiently dissipated, and its high thermal conductivity helps to maximize cooling performance. By using this type of heat sink, electronics manufacturers can ensure that their products remain cool and operational for as long as possible.

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