ATS-15E-167-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction Thermal - Heat Sinks have been used in electronics for decades. They are an integral part of the cooling process and serve to extend component life and ensure that thermal components are able to operate within their desired temperature range. The ATS-15E-167-C1-R0 is a newer type of thermal heat sink that is gaining popularity and has a wide range of applications. This article will explore the application field and working principle of the ATS-15E-167-C1-R0.Application Field The ATS-15E-167-C1-R0 can be used in a variety of applications. It is designed to provide thermal management for higher power components that require efficient heat transfer, such as CPUs, GPUs, chipsets, and high-end CPUs. This heat sink is also used in other applications such as automotive, industrial, and battery-operated devices. Additionally, ATS-15E-167-C1-R0 can be used in cases where air cooling is not appropriate due to the lack of sufficient airflow.The ATS-15E-167-C1-R0 is a versatile and reliable solution due to its wide range of applications. It is designed to provide effective and efficient heat transfer, while at the same time being lightweight and highly durable. Additionally, the ATS-15E-167-C1-R0 can be customized to fit specific applications and can be customized to include a number of features, such as waveguide grooves and mounting posts. Working PrincipleThe ATS-15E-167-C1-R0 has a unique design that provides efficient thermal dissipation. The design includes a central copper heat spreader and a series of aluminum fins that increase the surface area for better heat transfer. The aluminum fins are arranged in a specific pattern that maximizes air exposure to the heat spreader and copper heat leaf.The heat spreader is designed to be securely mounted to the PCB, ASIC, or other device. The heat spreader is then connected to the fins by screws and the heat is dissipated through the aluminum fins. The fins are designed with wavy designs which help to improve air flow and heat transfer. Additionally, air flow is improved by the fan clip which is used to securely hold the fan to the heat sink. The ATS-15E-167-C1-R0 is designed to be lightweight and durable, and it can be used in many different applications. It is rugged and can withstand extreme temperatures and vibration. Additionally, the ATS-15E-167-C1-R0 offers excellent thermal management and is designed to reduce noise levels.ConclusionThe ATS-15E-167-C1-R0 is a versatile and reliable Thermal - Heat Sink with a wide range of applications. It is designed to provide thermal management for higher power components, as well as for automotive, industrial, and battery-powered devices. The ATS-15E-167-C1-R0 is designed with a unique combination of copper heat spreader and aluminum fins that increase the surface area for better heat transfer. Additionally, its lightweight and highly durable design, as well as its fan clip, improve air flow and heat transfer. The ATS-15E-167-C1-R0 is ideal for many different applications and is an excellent choice for providing efficient and effective thermal management.

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