| Allicdata Part #: | ATS-15E-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-15E-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component for any electronics system. With the advance of digital systems, power dissipations of the chips are increasing so that temperature control is a must. In order to eliminate or reduce heat problems, thermally efficient heat sinks are important for efficient heat transfer. ATS-15E-20-C3-R0 thermal heat sink is a reliable product to meet the need of cooling and temperature management for many applications.
The ATS-15E-20-C3-R0 is a compact, highly efficient heat sink for cooling high power electronics systems and devices. It is made from extruded aluminum with excellent heat dissipation properties and optimized fin pitch. Its fins are soldered to the base of the heat sink for better heat transfer. It also comes with reinforced ribs which provide additional strength and rigidity. This heat sink is also designed with an integrated thermal pad that helps provide better contact between the heat sink and the device.
The ATS-15E-20-C3-R0 thermal heat sink is ideal for mid-range and high power heat dissipation applications. It can be used in a variety of applications such as computers, consumer electronics, medical, automotive, LED lighting and more. It is also well suited for board level integration and low profile applications. It can be used in a variety of cooling solutions such as fan-based heat sinks, cold plate assemblies and liquid cooling systems.
The ATS-15E-20-C3-R0 thermal heat sinks work by transferring heat from the source device to the air. Heat moves from a hot area to a cooler area. Heat is dissipated by conduction to the fins and convection of air. The fins act as a large surface area, providing efficient heat dissipation. The fins are arranged in a grid pattern to create a large surface area which is beneficial for increasing the air to heat transfer ratio and reducing overall operating temperature.
The ATS-15E-20-C3-R0 thermal heat sink is highly efficient, reliable and cost-effective. It is designed to deliver maximum performance and reliability. It is a good choice for most heat dissipation applications where space or cost is a factor. With a robust construction, it can withstand the rigors of any application environment. This makes it a great choice for any application where heat dissipation is critical. It is also available in a variety of sizes to fit most applications.
The ATS-15E-20-C3-R0 thermal heat sink is a very efficient and reliable thermal solution for a wide range of applications. Its high performance, robust construction and easy installation make it a great choice for reliable and efficient heat dissipation. This makes it a great choice for applications where temperature management is important. It is also cost-effective and can be used in a variety of applications.
The specific data is subject to PDF, and the above content is for reference