| Allicdata Part #: | ATS-15E-54-C1-R0-ND |
| Manufacturer Part#: |
ATS-15E-54-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15E-54-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic devices is essential for the development of reliable, long-lasting products. Heat can be efficiently transferred from the device to the environment through the use of proper cooling solutions such as heat sinks, fans, or liquid coolants. One popular heat sink design is the ATS-15E-54-C1-R0, which combines an orderly stack of thin aluminum fins with an efficient thermal interface material. This heat sink is designed to transfer heat away from a variety of electronic components and is an excellent choice for applications where low-profile, efficient heat dissipation is required.
The ATS-15E-54-C1-R0 is comprised of 54 aluminum fins arranged in an orderly fashion to form a thin wall between the component’s heat source and the environment. The thin metal fins act as a conduit for heat transfer by providing a large amount of surface area for efficient conduction of heat. In addition, each fin is designed with multiple folds that create a larger surface area for the heat to dissipate. The heat sink also features an efficient thermal interface material between the fins and the heat source, which ensures maximum heat transfer between the two elements.
In terms of product efficacy, the ATS-15E-54-C1-R0 is an effective solution for cooling small and medium-sized electronics, such as personal computers, servers, printers, and industrial controls. Due to its low-profile design, the heat sink can be conveniently installed in a variety of locations with minimal risk of obstruction or interference. Additionally, the ATS-15E-54-C1-R0 is designed for use with a wide variety of CPU and graphics cards, making it an ideal solution for many consumer electronics applications.
The effectiveness of the ATS-15E-54-C1-R0 heat sink is based on its ability to quickly and efficiently dissipate heat away from the heat source. The orderly arrangement of the aluminum fins and the efficient thermal interface material create an efficient network of thermal pathways that direct heat away from the device. To achieve maximum thermal performance, the fins should maintain contact with the surface of the heat source and be perpendicular to the direction of the air flow. This well-designed heat sink is an excellent choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference