| Allicdata Part #: | ATS-15F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-15F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks offer a variety of solutions for effective cooling of components or systems. The ATS-15F-10-C1-R0 is an advanced thermal solution that provides outstanding performance in both individual components and multiple applications. It is a high-performance, low-profile, all-aluminium heat sink designed for electronic applications to dissipate heat from components and systems.
The ATS-15F-10-C1-R0 heat sink has a total air convection-based system. It features two large fin channels running from the base to the top surface of the sink. There are also integrated channels running around the entire circumference of the sink. These provide increased cooling efficiency and allow air to flow around the entire heat sink. Additionally, the fin channels provide additional air plumes for optimal cooling.
The ATS-15F-10-C1-R0 is designed to provide maximum cooling for a wide range of applications. It is ideal for cooling components and systems, such as CPUs, GPUs, Application Specific Integrated Circuits (ASICs), LED illumination, power electronics for telecommunications and medical equipment, cables and metal casings. The high-performance heat sink dissipates large amounts of heat and is ideal for applications where high temperature environments are involved. The overall size of the ATS-15F-10-C1-R0 is 103 mm x 103 mm and has an overall height of only 15mm.
The ATS-15F-10-C1-R0 has an excellent thermal dissipation system, which uses natural air convection through the heat sink’s fins. This makes it stable, efficient and reliable, even in demanding environments. The air flow is directed from the base level up through the large fin channels and out onto the top surface. The natural air convection allows for maximum cooling capacity. The two fin channels running through the base of the heat sink also provide additional air plumes for optimal cooling and performance.
The ATS-15F-10-C1-R0 is very easy to install in any system. It has an industry-standard mounting hole pattern and an integrated mounting bar for added convenience. The mounting bar allows for a secure fit and is easy to reposition without the need for additional wiring. Additionally, it can be directly mounted to a circuit board or other components with its simple three-point mounting system.
The ATS-15F-10-C1-R0 is an excellent choice for a wide range of applications and offers high performance cooling for components and systems. It is designed for reliable long-term use and is capable of dissipating large amounts of heat in demanding environments. Its natural air convection aids in cooling and its simple mounting system allows for easy installation. The ATS-15F-10-C1-R0 is a great choice for those in need of a reliable, efficient thermal solution.
The specific data is subject to PDF, and the above content is for reference