| Allicdata Part #: | ATS-15F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-15F-10-C3-R0 is a thermal - Heat Sink designed for heat transfer from one object to another. It is applied in a variety of applications such as: servers, storage solutions, industrial, medical, automotive, consumer electronics, military and aerospace. By utilizing the heat sink\'s heat transfer capabilities, it can maintain a consistent temperature of the components it is attached to.
Application Field
The main application area of the ATS-15F-10-C3-R0 thermal - Heat Sink is to cool down high-power electronic components such as CPUs, graphic cards, and other high-performance components. It is also used to keep the temperature of LED lighting and other applications such as HDDs (Hard Disk Drive) cool. The Heat Sink can also be used to heat up data centers and server rooms for efficient thermal control.
Working Principle
The ATS-15F-10-C3-R0 thermal - Heat Sink is designed to work by using the process of convection. By placing the Heat Sink between the heat source and a cooler environment, the air around the Heat Sink is heated. This is due to the air being a better conductor of heat than just the Heat Sink itself, which then carries the heat away from the source. By cooling down the air, the heat source is accordingly cooled down. The Heat Sink is constructed with an array of small fins that increase its surface area - allowing more air to pass through; thus improving the Heat Sink\'s cooling abilities.
Design Considerations
The ATS-15F-10-C3-R0 thermal - Heat Sink is designed for a specific purpose and should not be altered for other applications. As well, the Heat Sink must be placed in a location where it can effectively manage heat and airflow. It also needs to be mounted so that it is away from any other heat sources and stay within the recommended operating temperature range. To ensure it works properly, the Heat Sink should be placed in a place that will allow it to effortlessly circulate and transfer heat.
Conclusion
The ATS-15F-10-C3-R0 thermal - Heat Sink is an effective tool for cooling down high-power electronic components. Its design allows for efficient transmission of heat away from the source, while also allowing it to operate efficiently within the recommended temperature range. It is also important to take into consideration the location of the Heat Sink in order to ensure it works properly for its intended purpose. With proper use, the ATS-15F-10-C3-R0 Heat Sink can be a valuable addition to any heat transfer system.
The specific data is subject to PDF, and the above content is for reference