| Allicdata Part #: | ATS25823-ND |
| Manufacturer Part#: |
ATS-15F-106-C2-R1 |
| Price: | $ 5.18 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-106-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.70610 |
| 10 +: | $ 4.58073 |
| 25 +: | $ 4.32608 |
| 50 +: | $ 4.07156 |
| 100 +: | $ 3.81704 |
| 250 +: | $ 3.56257 |
| 500 +: | $ 3.30810 |
| 1000 +: | $ 3.24449 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15F-106-C2-R1 is a thermal heat sink typically used for passive thermal management in various electronic applications. It is a two-stage, finned passive heat sink composed of a low-mass, low-density body and a high-performance, heat-conducting aluminum base. The heat sink’s design includes a fin profile that enhances contact between the component’s case and the heat sink’s base plate. The heat sink can be used in many electronic applications such as consumer electronics, industrial machines, medical devices, and computer systems.
The ATS-15F-106-C2-R1 is a very effective and efficient cooling solution for a variety of applications, including those involving high heat fluxes or complex thermal challenges. It provides superior cooling and heat-dissipation performance, even in harsh operational and environmental conditions. The heat sink’s two-stage design improves thermal transfer at the component-to-heat sink interface, leading to improved cooling performance. In addition, the fin profile and deep fins increase the total surface area, allowing for more efficient heat transfer from the heat source to the ambient environment.
The ATS-15F-106-C2-R1 is designed to work most effectively in applications where air convection cooling is the primary cooling method. Air convection is the process by which hot air is drawn away from a heat source by cooler air being drawn in from the surrounding environment. This is facilitated by the heat sink’s fin profile and deep fins, which allow for more efficient air convection cooling. The fins also help to dissipate heat by providing more surface area for heat to diffuse away from the components.
The ATS-15F-106-C2-R1 is highly reliable and efficient at dissipating heat away from the component being cooled, allowing for more reliable component performance. This is due to its ability to effectively move heat away from the hot spots of the component and distribute the heat evenly over the entire surface area of the heat sink. The heat sink also has a very low profile, which allows it to fit in tight areas and is less likely to cause interference with other components. This thermal heat sink is also low-cost and easy to install, making it an attractive solution for a variety of applications.
The ATS-15F-106-C2-R1 is a great choice for many applications and is particularly useful for cooling components, systems, and devices that generate high levels of heat flux. Its effective thermal transfer capabilities, reliable operation, and low cost make it a popular choice for many thermal management solutions. It is the perfect choice for applications where thermal performance, reliability, and efficiency are paramount.
The specific data is subject to PDF, and the above content is for reference