| Allicdata Part #: | ATS-15F-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-15F-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15F-110-C3-R1 is a thermal heat sink specifically designed for cooling electronic applications. This high performance heat sink offers excellent thermal conduction, and efficient heat dissipation. It is ideal for applications such as LED lighting, power electronics, consumer electronics, and medical equipment.
Thermal heat sinks are designed for the purpose of dissipating heat from applications such as circuits, processors, and other sensitive electronic components. They are usually composed of a metal base plate that acts as a heat spreader, and a set of aluminum or copper fins that are designed to maximize air-flow and draw heat away from the device. The heat sink is mounted onto the device to be cooled via screws, and it is kept in contact with the device by the use of thermal paste or heat sink compounds.
The ATS-15F-110-C3-R1 heat sink is made of an aluminum fin stack and extruded aluminum base plate, providing an excellent thermal solution for electronic devices. It provides incredible cooling performance with its large heat sink base and extended area of heat sink fins. The optimized fins ensure excellent heat dissipation, and the fin pitch is such that maximum air flow is achieved, reducing the risk of thermal failures.
The ATS-15F-110-C3-R1 has a maximum thermal resistance of 0.82°C/W, which is very impressive considering the size of the heat sink. It also features a design with solderable tabs for easy connection to the device\'s ground pin. This feature ensures that there is an efficient thermal path between the device and the heat sink for effective cooling.
The ATS-15F-110-C3-R1 is highly effective in decreasing the internal temperature of an enclosed electronic device. This enables it to prevent damage due to overheating, and ensure optimal performance for the device. The heat sink is simple to install and extremely reliable, making it a great choice for any application.
The specific data is subject to PDF, and the above content is for reference