| Allicdata Part #: | ATS-15F-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-15F-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component of many modern electronics, providing essential cooling characteristics to delicate components. ATS-15F-115-C1-R0 heat sinks are compact, reliable cooling solutions designed to fit in tight spaces and provide exceptional thermal properties. In this article, we will explore the application field, features, and working principles of ATS-15F-115-C1-R0 heat sinks for thermal management.
Application Field
ATS-15F-115-C1-R0 heat sinks are designed to provide effective cooling for high-density, low-profile electronic equipment. The ATS-15F-115-C1-R0 heat sinks feature unique fin designs to dissipate heat quickly and efficiently, for safe, reliable cooling at lower temperatures. The slim heat sink profile allows it to fit into even the tightest spaces.
The ATS-15F-115-C1-R0 heat sink is most often used in consumer electronics, such as televisions, DVD players, gaming consoles, and home stereo systems. It is also suitable for use in industrial and commercial applications, such as servers, medical equipment, and telecommunications infrastructure.
Features
The ATS-15F-115-C1-R0 heat sink is constructed from high-grade aluminum alloy. In order to ensure fast and uniform thermal performance, the heat sink is designed with rounded fins for optimal heat dissipation. The fins are also designed to be low profile, allowing the heat sink to fit in tight spaces. Additionally, the heat sink features stainless steel screws and mounting brackets, for secure installation in any environment.
Working Principle
The ATS-15F-115-C1-R0 heat sink utilizes a simple but effective cooling process. The heat sink works by dissipating heat generated by the electronic components to the surrounding environment. Heat is transferred from the components to the heat sink through conduction, where it is dissipated into the surrounding air. As the heat is dissipated, the heat sink itself cools down, creating a reliable and efficient cooling process.
In order to ensure optimal performance, the heat sink must be installed correctly. Proper installation involves mounting the heat sink to the component, and connecting it to the power source. Additionally, the heat sink should be installed in an area where there is sufficient airflow, in order to maximize heat dissipation.
The ATS-15F-115-C1-R0 heat sink is an excellent choice for cooling high-density electronic components. Its slim design and efficient cooling process make it ideal for use in tight spaces, while its durable construction and stainless steel mounting brackets provide reliable performance in any type of environment.
The specific data is subject to PDF, and the above content is for reference