ATS-15F-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-15F-12-C1-R0-ND

Manufacturer Part#:

ATS-15F-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15F-12-C1-R0 datasheetATS-15F-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-15F-12-C1-R0 is a thermal - heat sink specifically designed for accurate mountings on commonly used PCBs. Heat sinks are an integral part of any machine or electronic device with any kind of processor because they are intended to take away the heat produced by the processor and its components. This particular model combines this heat absorbing ability with an integrate design line.

The ATS-15F-12-C1-R0 is made up of two main components: a body and fins. The fins are made up of highly conductive aluminum material. They transfer the heat away from the main processor and then out to the atmosphere. The body of this particular heat sink provides a secure mounting on the device or PCB, allowing for a tight fitting.

This particular model of thermal - heat sink has been designed to be universal, with its accurate mountings that can be adapted to a wide variety of different physical spaces and temperatures. In addition, the finned design increases the effectiveness of heat transfer up to 120% due to its increased surface area. This also helps to control those parts of the device that are sensitive to extreme temperatures.

The ATS-15F-12-C1-R0 is ideal for many different types of environments, particularly those with highly efficient components that need to dissipate a lot of heat. These include servers, computers, laptops, gaming consoles, and other electronics. It is also ideal for applications where extreme accuracy and precision are needed, such as medical and aerospace devices.

In addition, the integrated design of the ATS-15F-12-C1-R0 also ensures that air flow within the device is adhered to. This ensures that there is no unwanted buildup of hot air and, subsequently, no unnecessary heat wastage due to dust particles trapped in the device.

The construction of the ATS-15F-12-C1-R0 is also of very high quality. The heat sink contains tightly mounted components that are designed to withstand extreme temperatures, both hot and cold. This ensures that the heat sink is able to perform optimally in all conditions and that it is made to last for many years during its use.

Overall, the ATS-15F-12-C1-R0 is an excellent thermal - heat sink that is designed to work with a wide variety of applications. Its accuracy, quality construction, and integrated design make it ideal for a number of different scenarios, from gaming consoles to medical devices. Furthermore, its finned design is designed to increase its effectiveness, ensuring that heat is dissipated efficiently without any build-up of hot air.

The specific data is subject to PDF, and the above content is for reference

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