| Allicdata Part #: | ATS-15F-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-15F-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used to dissipate thermal energy from other components. The ATS-15F-143-C1-R0 is a type of heat sink that is specifically designed to absorb and dissipate heat from electronic and electrical components such as semiconductors, transistors, and power supplies. The heat sinks are constructed from either aluminum or copper depending on the application and are available in a variety of sizes and shapes.
The ATS-15F-143-C1-R0 is a technically advanced solution for applications that require efficient thermal protection. This heat sink features a compact, low profile design with a black powder-coated finish that is highly durable and corrosion-resistant. It also features a unique internal fin array that is optimized to maximize airflow while minimizing thermal resistance. The fins are designed to be angled in such a way that they induce a turbulent flow of air in the vicinity of the heat sink, which in turn helps to reduce any thermal related issues. Additionally, the fins are designed to move heat away from the component, to which the heat sink is attached, to other parts of the chassis or chassis components, which can make it more efficient at dissipating heat.
The ATS-15F-143-C1-R0 has many advantages over other types of heat sinks. It features a low thermal resistance, which makes it suitable for high-powered applications such as power supplies and high-capacity data systems. It is also designed to be easy to install and there is a range of accessories available to ensure that the heat sink is securely fixed. Moreover, the heat sink is designed for maximum airflow and can handle a wide range of temperatures and loads.
The working principle of the ATS-15F-143-C1-R0 is based on the concept of convection. Heat is transferred from the component to the fins, which then dissipates the heat away from the component to the surrounding air. This type of heat sink uses air to conduct heat away from the component, making it more efficient than other types of heat sinks. Additionally, the angled fin array is designed to create turbulence in the air around the heat sink, which helps to reduce the thermal resistance of the device, making it even more efficient.
The ATS-15F-143-C1-R0 is an ideal solution for applications that require efficient cooling and heat dissipation. It is designed to be durable and delivers superior performance with a low thermal resistance. Its unique fin array also helps to increase the quality and performance of the system that it is part of, while simultaneously reducing any potential heat related issues. This makes it the perfect choice for high-powered applications, such as power supplies, as well as for larger data systems.
The specific data is subject to PDF, and the above content is for reference