| Allicdata Part #: | ATS-15F-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used for more than just cooling computer chips and other electronic components. They are also used in spreaders, coolers, and heat exchangers. They are designed to absorb and disperse heat from moving parts in various types of devices. The ATS-15F-181-C3-R0 is a thermal heat sink that comes in a variety of shapes and sizes, and can be used in many different applications.
The ATS-15F-181-C3-R0 is designed to achieve maximum thermal efficiency by providing maximum contact area between the air and the heat source. Its pierced fins absorb the heat from the air, and its strategically placed aluminum fins draw away the heat by extending outward. This system works by cooling the air that is conducted through the heat sink, providing an efficient cooling solution.
The ATS-15F-181-C3-R0 is a versatile thermal heat sink and can be used in a variety of applications. It is primarily designed for use with microprocessors or small electronic components to dissipate heat fast. It can also be used for thermal management of other high-powered components such as power supplies, graphics cards, and memory chips. With its extended fins, the ATS-15F-181-C3-R0 can provide an even more efficient cooling solution for high-powered components.
The ATS-15F-181-C3-R0 is designed to be used in multiple applications with its unique design. Its three-dimensional fin arrangement helps make the heat sink more efficient at dissipating heat. The design also ensures a better contact with air, which helps reduce hot spots and increase the thermal power of the heat sink. The air flow can also be adjusted with the use of a fan, which can help further reduce temperatures within the device.
The ATS-15F-181-C3-R0 is capable of working in any thermal system. Its aluminum fins are designed with a low thermal mass to ensure maximum heat air exchange. The reduced contact surface helps maintain efficient air temperatures even in the most demanding environments. The ATS-15F-181-C3-R0 also features a flexible mounting system to make installation easy and it can be set up to cool any board layout. This makes it an ideal solution for all types of thermal applications.
The ATS-15F-181-C3-R0 is an ideal thermal heat sink for a variety of applications. It offers maximum thermal efficiency with its pierced fins, aluminum fins, and three-dimensional fin arrangement. Its flexible mounting system and adjustable fan casing also help ensure that the device is able to remain efficient even in demanding environmental conditions. With its wide range of applications, the ATS-15F-181-C3-R0 can be the perfect solution for any thermal needs.
The specific data is subject to PDF, and the above content is for reference