| Allicdata Part #: | ATS-15F-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in any electronic device. Without proper management of heat, components can fail or be damaged due to excessive temperatures. Heat sinks are devices designed to transfer heat away from electronic components, by dissipating the heat over a larger surface area. The ATS-15F-198-C3-R0 is a common heat sink used to provide thermal management of a variety of electronic components.
The ATS-15F-198-C3-R0 is a high-performance, two-part heat sink that is designed to provide superior cooling performance for a range of electronic components. It is made of aluminum and has a top plate that is 1.6mm thick, and a base plate that is 0.6mm thick. The heat sink also features slotted fins, which increase surface area and maximize thermal efficiency. The base of the ATS-15F-198-C3-R0 is insulated with a special thermal isolator, which helps to reduce heat transfer from the device to the environment.
The ATS-15F-198-C3-R0 is suitable for use in a variety of applications, including power supplies, CPUs, circuits, and other components. It can also be used in systems that require uniform thermal management in very small spaces. The design of the ATS-15F-198-C3-R0 ensures that it will be thermally efficient, even in a compact space. This makes the ATS-15F-198-C3-R0 an ideal choice for many electronic applications.
The ATS-15F-198-C3-R0 works by transferring heat away from its surroundings. Heat is transferred from the heat source, such as an electronic component, through the heat sink’s fins, which act as a large surface area for cooling. The fins then dissipate the heat to the environment, effectively cooling the component. The insulation on the ATS-15F-198-C3-R0 helps to prevent heat from transferring back into the device, ensuring that the component remains at optimal temperatures.
The ATS-15F-198-C3-R0’s thermal management features make it an ideal choice for many electronic applications. Its design allows for efficient cooling in small spaces, and its insulation prevents heat from transferring back into the device. This makes it perfect for use in laptops, servers, and other compact electronic devices.
In short, the ATS-15F-198-C3-R0 is a high-performance, two-part heat sink that provides superior thermal management for a variety of electronic components. It is designed to allow efficient thermal management in very small spaces and its insulation helps to keep the component at optimal temperatures. The ATS-15F-198-C3-R0 is an ideal choice for providing thermal management for laptop, server, and other compact electronic devices.
The specific data is subject to PDF, and the above content is for reference