| Allicdata Part #: | ATS-15F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-15F-20-C3-R0 is a state-of-the-art thermal management solution that excels in applications requiring high reliability and efficient cooling performance. With its ability to efficiently dissipate heat, the ATS-15F-20-C3-R0 is well-suited for applications such as industrial, automotive, and military electronics that require cooling of high temperature sensors, components, and assemblies. The ATS-15F-20-C3-R0 is constructed using highly conductive aluminum material and provides optimized airflow capabilities for optimum performance.
The ATS-15F-20-C3-R0’s construction includes a combination of extruded aluminum, a series of pin fin type fins, and a series of tube fins. The extruded aluminum profile provides the heat sink’s standing on its own and overall frame, while the pin fin type and tube fins provide additional surface contact area to increase the heat dissipation rate. The pin fin type fins are designed to promote highly efficient air flow through the device for maximum cooling performance. The tube fins provide additional surface contact area to allow heat to dissipate at a higher rate. The combination of the extruded aluminum profile and the two fins improve the overall thermal performance of the ATS-15F-20-C3-R0 significantly.
The ATS-15F-20-C3-R0 is typically mounted with screws on either a solid surface or a frame. The installation is designed with easy-to-follow instructions and requires no additional heat tracking. The ATS-15F-20-C3-R0 also features a series of holes that can be used to attach wires, cables, and other components necessary for device installation or connection.
The ATS-15F-20-C3-R0 operates on the principle of thermodynamic convection. Convection is the process of transferring heat away from its source and into the surrounding environment. Heat is generated by electronic components and must be dissipated adequately to maintain proper operational temperature. In the case of the ATS-15F-20-C3-R0, heat is drawn away from the component and is dissipated through the metal fins. This allows the heatsink to efficiently reduce heat produced by electronic components while ensuring their reliability and longevity.
Overall, the ATS-15F-20-C3-R0 provides an optimal and reliable thermal management solution for high temperature electronics. The device is easy to install, does not require additional heat tracking, and offers excellentheat dissipation capabilities. The combination of the extruded aluminum profile and the two fins also makes it highly efficient and extremely reliable. The ATS-15F-20-C3-R0 is an ideal thermal management solution for any application requiring fast and reliable cooling performance.
The specific data is subject to PDF, and the above content is for reference