| Allicdata Part #: | ATS-15F-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-15F-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-15F-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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ATS-15F-27-C1-R0 thermal heat sinks are devices developed to manage the heat generated by electronic components. It works by dissipating the heat into its environment, ensuring the temperature of the component remains at a comfortable level. The ATS-15F-27-C1-R0 is designed for high performance applications, high power consumption or high heat generation due to high density components. Its technology can help reduce the temperature by up to 10°C of the components and ensures maximum transfer of heat without any thermal degradation.
Working Principle
The ATS-15F-27-C1-R0 thermal heat sink works on the principle of conduction. It is designed to transfer the heat generated from the component to its surrounding environment or to another component in the circuit. Heat is transferred from the hot component to the fins of the heat sink, which dissipates the heat into the surrounding air or environment. This process continues until the temperature of the component is lowered below its maximum rated temperature. The heat sink also works on the principle of convection. The convection principle helps in increasing the rate at which the heat is dissipated into the surrounding environment. The increased surface area of the fins helps in increasing the rate of exchange of heat between the component and the environment.Application Field
The ATS-15F-27-C1-R0 thermal heat sink has several applications in different areas. It is widely used in a variety of electronics such as computers, microprocessors, servers, telecom systems and various other high density electronic systems.It is also very popular in the automotive industry. Its efficient heat dissipation capabilities make it the perfect choice for electronic control units in cars, as they generate high amounts of heat due to their close proximity to the engine. In the field of medical electronics, the ATS-15F-27-C1-R0 is often used in medical equipment, pacemakers and other life-supporting systems. Its efficient cooling helps to ensure that the temperature of the components remains within the preset limits, and that the systems are able to run smoothly.Finally, in the field of aeronautics, the ATS-15F-27-C1-R0 thermal heat sink is used in aircraft engines, electrical systems and in other aerospace systems that have to withstand extreme temperatures and environments. Its superior cooling capabilities helps to ensure that the systems remain running optimally, without any interruptions.The specific data is subject to PDF, and the above content is for reference
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ATS-15F-27-C1-R0 Datasheet/PDF