| Allicdata Part #: | ATS25944-ND |
| Manufacturer Part#: |
ATS-15F-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part in the operation and performance of electronic devices. Heat sinks are used for this purpose, and the ATS-15F-27-C2-R0 is a thermal heat sink designed for thermal management of high powered components. The ATS-15F-27-C2-R0 heat sink manages the temperature of the components it is mounted to by dissipating heat away from the components and into the ambient environment.
The ATS-15F-27-C2-R0 heat sink is designed to manage the temperature of high powered surface mount components such as microcontrollers, transistors and other components with maximum power dissipation of 2W. The heat sink is made of aluminum, and features a finned design for improved heat dissipation and a two-pin mounting system with screws for easy installation and mounting.
The ATS-15F-27-C2-R0 heat sink uses convection to dissipate the heat from the component into the environment, which helps keep the temperature of the component within its useful or tolerable range. By using the finned design, it allows more air to get into contact with the heat sink, which increases the amount of heat that can be dissipated from the component. The two-pin mounting system ensures that the heat sink is mounted securely onto the component, which helps in increasing the heat dissipation rate. The use of aluminum material, instead of plastic or other metals, helps reduce the thermal resistance and increases the overall efficiency of the heat sink.
The ATS-15F-27-C2-R0 heat sink is an effective solution for the thermal management of high powered components. It is a reliable and cost-effective way to manage temperature, as it allows more heat to be dissipated into the environment and away from the component. The finned design and two-pin mounting system make installation and mounting quick and easy, while the aluminum material ensures that the thermal resistance is reduced and the efficiency of the heat sink is maximized. With its reliability and performance, the ATS-15F-27-C2-R0 heat sink is an ideal solution for the thermal management of high powered components.
The specific data is subject to PDF, and the above content is for reference