| Allicdata Part #: | ATS-15F-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15F-27-C3-R0 heat sink is a thermal solution designed for a wide variety of applications. Specifically, it is mainly used for applications which need a low profile and high thermal performance. The ATS-15F-27-C3-R0 heat sink incorporates an innovative design and uses special aluminium alloy materials which are highly thermally conductive and efficient. It is one of the most reliable and cost-effective thermal solutions on the market.
The main purpose of a heat sink is to conduct heat away from sensitive components, such as CPUs, GPUs, memory, storage, and other electronic components. The ATS-15F-27-C3-R0 heat sink is designed to do exactly that. It is designed to provide excellent thermal performance while being small enough to fit into tight spaces. The heat sink features an optimized fin array which allows for better heat dissipation. The fin array also helps to maximize thermal contact between the component and the heat sink.
The ATS-15F-27-C3-R0 heat sink also uses special aluminium alloy materials which are highly competent thermal materials. This ensures that heat is quickly and efficiently conducted away from the component. In addition, the heat sink features a carefully designed multi-slotted fin design which offers excellent air convection, resulting in improved thermal performance. Furthermore, the heat sink is also designed to be very durable and reliable, with its powder coat finish ensuring protection against corrosion.
The ATS-15F-27-C3-R0 heat sink is suitable for a wide variety of applications, such as cooling for CPUs, GPUs, motherboards, integrated circuits, memory chips, storage devices, and other electronic components. It is also suitable for laptops, tablets, and other portable devices. Since the heat sink is low profile and has a specialized fin array, it can fit into tight spaces and offer superior thermal performance. In addition, the ATS-15F-27-C3-R0 heat sink is also a great choice for desktop PCs and servers, since it can reduce system noise and improve system reliability.
In conclusion, the ATS-15F-27-C3-R0 thermal-heat sink is an excellent choice for a wide variety of applications. It combines an efficient and reliable thermal performance with an ergonomic design, allowing it to fit into tight spaces. In addition, it uses specialized aluminium alloy materials which are highly thermally conductive and efficient. This helps to ensure that heat is quickly and efficiently conducted away from the component, resulting in an improved thermal performance. The ATS-15F-27-C3-R0 heat sink is an affordable and reliable thermal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference