| Allicdata Part #: | ATS-15F-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-15F-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a technology that helps control the exchange of heat between devices and their environment in order to maintain optimal temperature levels. Heat sinks are one of the most commonly used methods for thermal management; they are designed to absorb excess heat from a device and dissipate it to the surrounding environment.
ATS-15F-30-C1-R0 is an aluminum extruded heat sink composed of a base plate, a finned extrusion, and a cap. The base plate is used to make contact with the device in need of cooling and is attached using mechanical fasteners. The finned extrusion is made of aluminum and uses a series of vertical fins pressed in a parallel pattern to maximize the surface area and airflow to better dissipate the heat. The cap is attached to the top of the finned extrusion and is used to hold it in place and keep the fins enclosed. This heat sink can dissipate up to 30W of power.
The working mechanism of the ATS-15F-30-C1-R0 heat sink is based on the principle of convection. This heat dissipation technique works by using the natural convection of air to conduct the heat away from the device and dissipate it to the environment. The fins on the heat sink increase the surface area, which allows for better heat dissipation as more air is exposed to the surface. This increased surface area also creates a turbulent airflow, which helps to further dissipate the heat. Additionally, the cap on the top of the heat sink acts as an insulator to prevent the escape of heat radiation.
The ATS-15F-30-C1-R0 heat sink is suitable for use in a wide variety of applications. One of the most common applications is computer and electronics cooling due to its light weight and high thermal dissipation capacity. This heat sink can also be used for LED lighting to dissipate the intense heat generated by the LED chips. Additionally, it is suited for cooling industrial systems such as HVAC, Robotics, and Machinery applications, as well as providing thermal management for power converters and power supplies.
In summary, the ATS-15F-30-C1-R0 heat sink is an efficient and cost-effective thermal solution for a wide variety of applications. It is easy to install, requires minimal maintenance, and is highly durable. This heat sink uses the convection principle to dissipate heat, which helps to keep devices running safely and efficiently. Its lightweight construction and high thermal dissipation capacity make it perfect for applications such as computer cooling, LED lighting, and industrial machinery. With its high performance and wide range of applications, the ATS-15F-30-C1-R0 is an ideal thermal management solution for any application.
The specific data is subject to PDF, and the above content is for reference