ATS-15F-30-C3-R0

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Heat sinks are devices used to transfer and dissipate heat away from a component. While there are different types of heat sinks, like liquid and air-cooled, the ATS-15F-30-C3-R0 is specifically a heat sink for electronics. This heat sink is a reliable, cost-effective solution for cooling applications that require a tight thermal budget and is well-suited to a variety of applications.

The ATS-15F-30-C3-R0 is a thermally efficient single-sided integrated heat sink (ISH) that is suitable for power dissipation in electronics, including memory, CPUs, ASICS, and GPUs. It is designed for low to moderate capacity vertical board mount components where space is limited, such as tablets and small embedded systems. The cooling performance of the ATS-15F-30-C3-R0 is due to its high thermal conductivity and optimized construction. This heat sink comes in an aluminum housing with aluminum fin for heat dissipation and a spring clip for secure mounting. The aluminum housing and fin are both plated with a black coating to dissipate heat quickly and evenly, and to also disperse the heat to the surroundings reducing stressful hotspots and potential burnouts.

The ATS-15F-30-C3-R0 has a high surface to volume ratio, resulting in improved thermal transfer compared to other, more common heat sinks designs. The optimized construction also helps reduce airflow resistance which further improves cooling performance. The ATS-15F-30-C3-R0 can be easily mounted on a variety of types of surfaces, making this a suitable heat sink for a variety of applications. Because of its reliable thermal performance and low to moderate power capabilities, the ATS-15F-30-C3-R0 is suitable for applications such as audio systems, medical imaging, test and measurement, LED lighting, and set top boxes.

The working principle of the ATS-15F-30-C3-R0 is to quickly and efficiently transfer heat away from the device it is mounted to using the aluminum fin conducting the heat away from the mounted device. The aluminum housing also generates a convection cooling effect through the air movement generated by the aluminum fin. As the air flows around the heat sink, the hot air rises and is replaced with cooler air. This natural occurrence of convection cooling helps further dissipate the heat away from the device.

The ATS-15F-30-C3-R0 is a reliable and efficient heat sink that is specifically designed for low to moderate power capacity. It is well-suited for a variety of applications that require a tight thermal budget and has been designed to effectively transfer and dissipate heat away from the component it is mounted to. Its high surface to volume ratio, combined with a strong thermal conductivity make the ATS-15F-30-C3-R0 ideal for applications such as audio, medical imaging, test and measurement, LED lighting, and set top boxes.

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