ATS-15F-32-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	21.54°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-15F-32-C3-R0 is a thermal management device, specifically a heat sink. Heat sinks are designed to dissipate thermal energy from system components such as processors, graphics cards, and other high-heat generating components. In this article, we will discuss the application field and working principle of the ATS-15F-32-C3-R0 thermal management device.

Applications

The ATS-15F-32-C3-R0 thermal management device can be used in a variety of applications. It is suitable for electronics and appliances requiring high current and high-power applications. It can be used in telecommunications, servers, data centers, and other applications involving large amounts of heat.The device is also used in automotive electronics, particularly in automotive infotainment systems, engine control units, and other heat-sensitive electronic components. It can also be used in medical and biomedical applications, including medical devices and devices used to monitor vital signs.The device can also be used to keep sensitive components cool in consumer, industrial, and other applications. It is suitable for use with microprocessors, power supplies, and other components that generate large amounts of heat.

Working Principle of the ATS-15F-32-C3-R0

The ATS-15F-32-C3-R0 thermal management device works by transferring and dissipating heat from system components. The device is designed to provide a high-performance heat sink solution for dissipating thermal energy from electronic components.The device is equipped with a low-profile design and optimized fins that allow for efficient heat transfer from components. This allows the device to dissipate heat over a wider surface area. Additionally, the fins act as a buffer, protecting components from direct contact with the heat.The device is also equipped with a pin-in base that is designed to provide optimal thermal contact with the component. This ensures a secure connection between the device and the component, allowing the device to quickly dissipate heat from the component.The device also features an integrated thermal resistance rating to ensure optimal thermal performance. This rating allows the device to operate at optimal temperatures, ensuring that components remain cool and protected.

Conclusion

The ATS-15F-32-C3-R0 thermal management device is a high-performance heat sink solution that is suitable for a variety of applications. It is designed to dissipate thermal energy from components quickly and efficiently. The device features a low-profile design, optimized fins, and a pin-in base for optimal thermal contact with components. Additionally, it has an integrated thermal resistance rating to ensure optimal thermal performance.

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