| Allicdata Part #: | ATS-15F-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-15F-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15F-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for many industrial processes and applications that require a controlled environment. One such solution is the ATS-15F-70-C3-R0, a heat sink designed with integrated thermal management solutions. The ATS-15F-70-C3-R0 is an aluminum extrusion with perforated fins and a copper tube, providing a highly efficient thermal solution. Its primary purpose is to remove unwanted heat while dissipating it quickly and efficiently.
The ATS-15F-70-C3-R0 is designed with an integrated cooling circuit, designed to reject heat much more quickly than a traditional heat sink. Its integrated design allows for airflow to quickly circulate through the pipe and across the fin surfaces, making it much more effective at removing large amounts of heat from the system compared to a traditional heat sink. Additionally, the aluminum extrusion construction allows for a lightweight design, making it ideal for applications where lightweight, efficient cooling solutions are essential.
The ATS-15F-70-C3-R0 also has a wide range of applications. It is most commonly used in applications that require a large amount of heat to be removed quickly and efficiently such as semiconductor devices and computer CPUs. Other applications include IC and LED lighting systems, automotive electronics, and medical devices. The ATS-15F-70-C3-R0 is also suitable for applications in defense and aerospace due to its lightweight design, high performance, and durability.
The working principle of the ATS-15F-70-C3-R0 is based on the principle of convective heat transfer. Heat is transferred from a solid object to the surrounding air through heat conduction and convection. This type of heat transfer is most effective when there is a large temperature difference between the two materials, allowing heat to be quickly and efficiently dissipated. The ATS-15F-70-C3-R0 has integrated fins that increase surface area, allowing for more efficient heat transfer. Furthermore, the copper tube is designed to draw heat away from the device and into the fins, allowing for heat to be removed more quickly than a traditional heat sink.
With its integrated design, the ATS-15F-70-C3-R0 provides highly efficient thermal management solutions for a wide range of applications that require an integrated cooling solution. Its lightweight design and high performance makes it an ideal solution for applications that require a lightweight, efficient cooling solution. Additionally, its convective heat transfer principle makes it a highly effective and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference