ATS-15F-99-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15F-99-C3-R0-ND

Manufacturer Part#:

ATS-15F-99-C3-R0

Price: $ 4.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15F-99-C3-R0 datasheetATS-15F-99-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.07169
30 +: $ 3.84531
50 +: $ 3.61910
100 +: $ 3.39293
250 +: $ 3.16673
500 +: $ 2.94054
1000 +: $ 2.88399
Stock 1000Can Ship Immediately
$ 4.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has been a key factor in the engineering of electronic components and products for long. In order to eliminate the harmful effect of high temperature, different types of thermal management solutions have been used over the years. Among the many thermal solutions, one of the most successful ones is heat sinks. Heat sinks are specifically designed to transfer heat away from a component or system to an environment that is cooler. They are often used to control the temperature of a system or component so as to ensure high performance and long life. The ATS-15F-99-C3-R0 is a Heat Sink specifically designed to be used in applications where good cooling performance is crucial. It is a highly efficient heat transfer device that is capable of cooling systems up to temperatures of 150°C.The ATS-15F-99-C3-R0 Heat Sink is equipped with a special copper-aluminum-magnesium alloy fin core and DC air transmission technology for the highest efficiency in heat transfer. The device also houses multiple copper heat pipes and high-performance cooling fans along with a copper base plate for the efficient cooling of electronic components. The device is specifically designed to be used in applications where time and space are a premium such as in telecommunications, automotive, military, and aerospace applications.The ATS-15F-99-C3-R0 Heat Sink works by transferring heat away from the component or system to the environment that is cooler. It works on the principle of conduction and convection. The special alloy fin core is designed to conduct heat away from the component while the copper heat pipes help to propagate this thermal energy away from the system. The high-performance cooling fan within the Heat Sink helps to channel the heat away from the system and into the environment by dissipating it into the atmosphere.The ATS-15F-99-C3-R0 Heat Sink is one of the most efficient methods of controlling the temperature of a system or component. By transferring the heat away from the system it helps to ensure the long life of the component as well as improved performance due to better cooling. It is also highly reliable and cost effective thus making it suitable for use in applications where space is limited. The ATS-15F-99-C3-R0 Heat Sink is therefore well suited for applications such as telecommunications, automotive, military and aerospace projects.

The specific data is subject to PDF, and the above content is for reference

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