| Allicdata Part #: | ATS26024-ND |
| Manufacturer Part#: |
ATS-15G-109-C2-R1 |
| Price: | $ 5.50 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-109-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.99590 |
| 10 +: | $ 4.85793 |
| 25 +: | $ 4.58816 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are an important part of electronic engineering, integral to the performance of a wide array of electronic components and assemblies. ATS-15G-109-C2-R1 thermal - heat sink is a leading thermal solution for high power density components. It provides excellent thermal conductivity for efficient heat dissipation and has a compact design suitable for most applications.
The ATS-15G-109-C2-R1 thermal-heat sink has a number of distinct features and advantages, such as a white algodon G10/FR4 thermal interface material that provides a flexible and conformable bonding between the heat sink and its mating component, as well as low heat development and outgassing due to its non-toxic characteristics. Other features include a highly effective voice coil motor for dynamic air Ventilation, and large internal oxygen balance gases for enhanced cooling. Furthermore, the ATS-15G-109-C2-R1 thermal-heat sink can be mounted in almost any orientation.
In terms of application, the ATS-15G-109-C2-R1 thermal-heat sink can be used for a wide range of applications. It is ideal for high power applications, such as circuit boards, ASICs, amplifiers, transistors, and active components. Additionally, its high-performance thermal solutions are capable of supporting the cooling of high power LEDs, laser diodes, and other high-power semiconductor devices. Moreover, the thermal-heat sink can also be used to address challenges related to high-end multimedia applications and extended-temperature range analog circuits.
In terms of working principle, the ATS-15G-109-C2-R1 thermal-heat sink is designed to provide an effective cooling system. It has a number of features which allow it to dissipate heat away from the components and assemblies it is connected to. The thermal-heat sink includes a series of fins that are dip-coated in thermally conductive epoxy to increase cooling effectiveness. Additionally, it also uses an innovative air-rift gap technology which helps to efficiently channel the hot air away from the components. Additionally, the thermal-heat sink integrates a unique voice coil motor technology which helps to optimize airflow, maximizing the heat sink’s ability to dissipate heat.
In conclusion, the ATS-15G-109-C2-R1 thermal-heat sink is a flexible and efficient thermal solution for a variety of power-dense applications. It features excellent thermal conductivity for efficient heat dissipation and its compact design is suitable for most applications. It is capable of providing cooling to high power components, as well as high end multimedia applications and extended-temperature range analog circuits. Lastly, its innovative air-rift gap and voice coil motor technologies further add to its efficiency and effectiveness.
The specific data is subject to PDF, and the above content is for reference