| Allicdata Part #: | ATS-15G-118-C1-R0-ND |
| Manufacturer Part#: |
ATS-15G-118-C1-R0 |
| Price: | $ 3.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-118-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.90052 |
| 30 +: | $ 2.82240 |
| 50 +: | $ 2.66553 |
| 100 +: | $ 2.50872 |
| 250 +: | $ 2.35192 |
| 500 +: | $ 2.27352 |
| 1000 +: | $ 2.03833 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are utilized in a wide range of applications to facilitate the efficient dissipation of heat from electronic equipment and components. Thermal sinks are critical to the reliable operation of many types of systems, and can prevent the overheating of components and materials, as well as other inconveniences which may arise from the lack of proper cooling. The ATS-15G-118-C1-R0 thermal – heat sink is one such device, and its particular application field and operating principles should be understood as a matter of course by any who work with or around such systems.
The ATS-15G-118-C1-R0 thermal – heat sink is designed for use on low profile PCs or other similarly sized devices. Its dimensions are 32mm x 32mm x 18.2mm, and it features a copper base plate and fins for improved heat transfer characteristics. This thermal – heat sink is designed to dissipate heat from the PC\'s processor, memory, and other components, and can operate at a temperature of -45 to 85 degrees C, making it an ideal solution for small embedded system applications.
The ATS-15G-118-C1-R0’s operating principle is simple, yet effective. Hot air is pulled in through the top of the thermal – heat sink via a fan, and is expelled out of the bottom of the device. As the hot air passes through the device, it is cooled by the copper baseplate and fins, which absorb and dissipate the heat. This process continues until the component temperature has been sufficiently reduced and the desired cooling has been achieved.
In addition to its cooling ability, the ATS-15G-118-C1-R0 has several other features that make it an attractive choice for embedded systems. In particular, it has a low profile bracket that is designed to fit tight against the component being cooled, improving overall heat transfer efficiency. Additionally, it has a wide operating temperature range and a low power consumption of only 3.5 Watts, making it quite economical. It has a fairly high static pressure of 2.2 mmH2O, and is also able to reach an airflow of 2.8 CFM, further increasing its ability to cool components quickly and effectively.
Overall, the ATS-15G-118-C1-R0 thermal – heat sink makes an excellent choice for use in embedded systems, as well as other low profile PCs. Its ability to efficiently dissipate heat quickly and cost effectively make it an ideal solution for many applications. The device has a low profile design, a wide temperature range, low power consumption, and is able to reach high static pressure and airflow. With such an impressive array of features, it is easy to see why the ATS-15G-118-C1-R0 is a popular and highly sought after choice for embedded system solutions.
The specific data is subject to PDF, and the above content is for reference