| Allicdata Part #: | ATS-15G-130-C1-R0-ND |
| Manufacturer Part#: |
ATS-15G-130-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-130-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.56265 |
| 30 +: | $ 3.36462 |
| 50 +: | $ 3.16676 |
| 100 +: | $ 2.96881 |
| 250 +: | $ 2.77089 |
| 500 +: | $ 2.57297 |
| 1000 +: | $ 2.52349 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from electrical components or processes. Thermal management is a critical factor that can have a direct effect on the performance, reliability, and longevity of any electronic components. In order to achieve maximum heat transfer efficiency, a well-designed thermal management solution is required.
The ATS-15G-130-C1-R0 heat sink is a great solution for cooling hot components. Designed to meet the highest thermal management requirements, the ATS-15G-130-C1-R0 offers a combination of high thermal conductivity and low thermal resistance. It is available in both anodized aluminum and copper versions, and features a unique, micromachined fin structure for increased surface area. The device is also equipped with a high-efficiency heat spreader and a proprietary, pressure-adjusted retention plate for easy installation and reliable service.
The ATS-15G-130-C1-R0 is ideal for a variety of cooling applications, including telecommunications and networking, data storage, industrial electronics, aerospace, automotive, consumer electronics, and embedded systems. The device helps to maintain a consistent temperature within the electronic components, improving performance and reliability. In addition, the device is designed to minimize the risk of thermal shock, which can degrade performance and cause permanent damage to the electronics.
The working principle of the ATS-15G-130-C1-R0 heat sink is based on a phenomenon called convective heat transfer. This process occurs when a hot surface comes into contact with a cooler surface. Heat transfer takes place when hot molecules move away from the hot surface and are replaced by cooler molecules from the cooler surface. This results in a lowering of the overall temperature of the system, and the heat is dissipated to the atmosphere.
To maximize the heat transfer efficiency of the ATS-15G-130-C1-R0 heat sink, careful attention must be paid to the installation process. It is important to ensure that the device is securely mounted and properly sealed to prevent air from entering the system and reducing the overall cooling effect. Additionally, the device must be installed in a position that allows for an unobstructed flow of air-cooled air around the device. If installed in a cramped area or a tight-fitting space, the cooling performance of the device may be reduced.
In conclusion, the ATS-15G-130-C1-R0 heat sink is a reliable, easy-to-install thermal management solution for cooling hot components. Its unique fin structure provides excellent thermal conductivity and low thermal resistance, making it an ideal choice for a variety of cooling applications. The device is designed to ensure efficient heat transfer, minimize thermal shock, and prolong the life cycle of any electronic components it is used with.
The specific data is subject to PDF, and the above content is for reference