ATS-15G-138-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-15G-138-C3-R0 is a product of the well-known company Alpha Thermal Solutions, a supplier of high-end cooling components for both commercial and industrial applications. It is categorized as a thermal - heat sinks device and designed for medium to high power applications. The thermal product is made of heat dissipation components and technologies to ensure optimal cooling performance.

Application Field

The ATS-15G-138-C3-R0 can be used for a wide variety of applications, including computer systems, x-ray machines, telecommunications, automotive, medical, digital equipment, and industrial machinery. Its thermal dissipation technology makes it suitable for medium and high-power applications. It is also capable of reducing heat passed up to 6 watts.

Working Principle

The ATS-15G-138-C3-R0 works by dissipating heat away from its source and then radiating the heat to ambient air or another cooling component. It is composed of an aluminum extrusion and heat sink base, as well as a heat conductive layer between them. The aluminum extrusion functions as a heat spreader and works to dissipate heat away from the source evenly.The heat sink base, on the other hand, is a copper block, which is designed to extraction heat from the component or enclosure that is mounted to the device. It then conducts the heat away from the source and radiating it to the air or other cooling components. In addition, a fan may be used to speed up the cooling process. The ATS-15G-138-C3-R0 is also designed with an optimized thermal profile, meaning that it has minimal thermal resistance. This ensures that heat is dissipated quickly and efficiently. The device also includes a thermal interface material, such as thermal paste, to ensure that there is no air gap between the heat sink and the component or enclosure that is mounted to it.

Conclusion

The ATS-15G-138-C3-R0 is a versatile thermal - heat sinks device designed for a wide variety of applications. It is a highly efficient solution for managing the heat produced in these applications. The device is composed of an aluminum extrusion, a heat sink base, and a heat conductive layer, as well as a thermal interface material such as thermal paste. The device is also equipped with an optimized thermal profile, which ensures that the device dissipates heat quickly and efficiently.

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