ATS-15G-150-C3-R0

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Thermal management is the process of controlling the temperature of an electronic device or system. Heat sinks are a popular method of thermal management, as they are effective in dissipating heat from components. The ATS-15G-150-C3-R0 heat sink is an excellent example of this type of thermal management product. Its application field and workings are outlined in this article.

Technology Overview

It is important to have a basic understanding of what a heat sink is before reviewing the application field and working principle of the ATS-15G-150-C3-R0. Heat sinks are passive, finned components that rely upon physical principles for dissipating heat from electronic components such as processors, transistors, and integrated circuits. Thermal conductivity is a key property of heat sinks. Heat is conducted from the component to the heat sink via an interface material, which is often a thermally conductive pad, paste, or adhesive.

ATS-15G-150-C3-R0 Application Field

The ATS-15G-150-C3-R0 is an example of a compact heat sink, offering superior thermal performance for electronic components in a wide range of applications. This versatile heat sink can be applied in computer and consumer electronics, Communication, Medical, Military, Automotive, and Industrial applications.

The performance of the ATS-15G-150-C3-R0 is best suited for applications with ambient temperatures between -50°C and +90°C, operating temperatures up to +200°C, and power capacity exceeding 15w. The ATS-15G-150-C3-R0 is a low cost option for reducing temperatures, while still providing effective thermal management for a wide range of applications.

ATS-15G-150-C3-R0 Working Principle

The ATS-15G-150-C3-R0 is a type of compact heat sink, using the principle of natural convection. The fuel heat sink itself is composed of a base plate and a fin type design. With a combination of an optimized base plate thickness and fin spacing, this design enables a maximum surface area for the heat to dissipate while keeping pressure drop to a minimum. The heat obstructs the transfer between the base and the fins, due to its low thermal conductivity.

The working principle of the ATS-15G-150-C3-R0 is based on the convective equilibrium of air (Figure 1), which is the same basic principle as that of convection-based heat sinks. Heat is produced by the component and conducted to the heat sink fins, to be dissipated by a fan or blower. Natural convection can be used in applications where the ambient temperature is relatively low and a fan or blower is not needed.

Heat is conducted from the component to the fins through two layers – the interface material and the contact area between the interface material and the fins. The choice of the interface material plays an important role in reducing thermal resistance and obtaining optimal performance from the heat sink. In this way, the ATS-15G-150-C3-R0 is able to disperse the heat evenly across all of its fins, maximizing its effectiveness as a thermal management solution.

Conclusion

The ATS-15G-150-C3-R0 is a compact heat sink designed for dissipating heat in applications with high ambient temperatures and high power capacity. Its robust construction and optimized fin design enable high thermal performance while keeping cost to a minimum. The ATS-15G-150-C3-R0 is suitable for a wide range of applications, including consumer electronics, medical, military, automotive, and industrial applications. Its working principle is based on natural convection, relying upon two layers of interface materials to conduct the heat from the component to the fins.

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