| Allicdata Part #: | ATS26072-ND |
| Manufacturer Part#: |
ATS-15G-152-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-152-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an integral part of any modern electronic system. From mobile devices to computers, heat sinks are used to prevent components from overheating and causing damage. The ATS-15G-152-C2-R0 is a high-performance, low profile heat sink designed for high-density electronic components. This article provides a detailed overview of the ATS-15G-152-C2-R0’s application fields and working principles.
Application Field and Requirements
The ATS-15G-152-C2-R0 is an ideal choice for high ambient temperature applications where thermal performance is critical. It is designed to dissipate up to 15W per unit, making it suitable for both common and unique components. Due to its thin profile, the ATS-15G-152-C2-R0 is an especially suitable option for highly dense applications, where space is at a premium. Additionally, the unit is designed to allow for straight or angled mounting, and can be deployed in metal or plastic chassis.
The ATS-15G-152-C2-R0 is available in a variety of standard configurations, and can be customized to fit any shape or size requirements. It is constructed using a combination of aluminum and copper components, which provide excellent tensile strength and good thermal conduction.
Working Principles: Heat Transfer
The ATS-15G-152-C2-R0 utilizes two heat transfer processes to effectively dissipate heat away from electronic components. The first process is conduction, which is the transfer of heat from the hotter to the cooler material or environment through direct contact. In the ATS-15G-152-C2-R0, the heat is transferred from the source (component) to the heat sink through direct contact between their surfaces. Due to its construction, the ATS-15G-152-C2-R0 has a high thermal conductivity, which allows for greater heat transfer efficiency.
The second process utilized is convection, which is the transfer of heat from the hotter to the cooler material or environment through air circulation. In the ATS-15G-152-C2-R0, the heat is transferred from the source (component) to the heat sink fins and is then dissipated away to the surrounding environment. This process is able to occur due to a continuous supply of fresh air being circulated through the fins and heat sink. This circulating air cools the fins, allowing for sustained heat dissipation.
Conclusion
The ATS-15G-152-C2-R0 is a high-performance, low profile heat sink designed for high-density electronic components. Its thin design makes it an ideal choice for applications where thermal performance is critical and space is at a premium. Additionally, the unit utilizes conduction and convection to effectively dissipate heat away from the component. As such, it is an excellent choice for any electronic system that requires reliable thermal management.
The specific data is subject to PDF, and the above content is for reference