| Allicdata Part #: | ATS-15G-162-C1-R0-ND |
| Manufacturer Part#: |
ATS-15G-162-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-162-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential element in today’s products to ensure reliable, energy-efficient operation. Heat generated in an electronic component needs to be efficiently dissipated to ensure proper performance and operation. Heat sinks are commonly used in the industry to transfer heat away from a device and into the surrounding environment. One of the most common heat sinks on the market is the ATS-15G-162-C1-R0. This article will discuss the application field and working principle of this product.
The ATS-15G-162-C1-R0 is a single-piece heat sink designed for those who require a compact solution with a low profile. This heat sink is well suited for cooling applications such as microprocessors, power supplies, voltage regulators, and other electronics components that generate heat. The product uses thermally conductive aluminum for optimal efficiency and features a powercoat finish for improved durability and aesthetics.
To understand the working principle of the ATS-15G-162-C1-R0, it is important to first understand thermodynamics. The basic concept behind thermodynamics is that heat will always move from an area that is hotter than its surroundings to an area that is cooler. This process is known as conduction. With the ATS-15G-162-C1-R0, this thermal conduction is enhanced by the fin design and the thermally conductive aluminum. The fins are designed in such a way that they increase the surface area exposed to the environment, creating more space for the heat to travel through as it dissipates off the device. With the thermally conductive aluminum, the heat moves from the device into the heat sink more quickly and efficiently. Additionally, the power finish on the ATS-15G-162-C1-R0 provides additional durability and helps to protect it from corrosion and wear.
The ATS-15G-162-C1-R0 is one of the most popular heat sinks on the market. It is designed for those who require a compact and low profile solution with excellent thermal performance. The fins are designed to increase the surface area exposed to the environment and the thermally conductive aluminum ensures quick and efficient heat transfer. Additionally, the power finish helps to protect the unit from corrosion and wear. With these features, the ATS-15G-162-C1-R0 is perfect for cooling applications such as microprocessors, power supplies, voltage regulators, and other electronics components that generate heat.
The specific data is subject to PDF, and the above content is for reference