ATS-15G-178-C3-R0

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Thermal management, with its transfer of heat or heat dissipation, is an essential component of any given electronic system. From computers to cell phones, it is essential that electronic components remain adequately cooled in order to perform efficiently and to reduce any risk of component failure. Heat sinks are a popular choice for cooling electronic equipment, as they offer high levels of efficiency at a low cost.The ATS-15G-178-C3-R0 is one such product which provides effective thermal management. This specific heat sink consists of a compact aluminum body and a double fan design, as well as a full thermal pad covering, that ensures maximum thermal transfer from the object to the heat sink itself. This product is designed for environmental temperatures of between 0 and 70°C and has an air flow rate of 41.45CFM and a noise level of 29.0 dBA.

The ATS-15G-178-C3-R0 is an ideal choice for various electronic applications due to its large area for absorbing and dissipating heat. The product also has a large number of features to ensure it uses its options for maximum efficiency. These include an integrated louver fin array which aids in air circulation, and a stepped edge extrusion design which allows more air to pass through the heat sink. Additionally, it has a electro-plated finish which provides excellent corrosion resistance.

The ATS-15G-178-C3-R0 also offers excellent levels of thermal performance. This is achieved through the use of a double fan design which ensures more efficient cooling, as well as a full thermal pad covering which ensures maximum thermal transfer from the object to the heat sink. Furthermore, the product also has fixed mounting points, which provide an even spread of the air flow. This helps to ensure the heat dissipates away from the component and keeps the surrounding environment cool.

The working principle of the ATS-15G-178-C3-R0 is based on the concepts of heat transfer and dissipation. Heat transfer is achieved by the louver fins in the heat sink and their ability to absorb and transfer heat from the object. The double fan design then dissipates this heat away and into the surrounding environment via the airflow generated by the fans. This process, combined with the full thermal pad covering, ensures maximum levels of thermal efficiency.

In conclusion, the ATS-15G-178-C3-R0 is an effective thermal management solution which is suitable for a range of environmental temperatures and applications. It features an integrated louver fin structure, double fan design, and maximum thermal pad coverage to ensure maximum thermal transfer and dissipation. Additionally, it has fixed mounting points and a electro-plated finish for improved durability. The working principle of this heat sink is based on the concepts of heat transfer and dissipation, to ensure maximum levels of efficiency.

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