| Allicdata Part #: | ATS-15G-18-C1-R0-ND |
| Manufacturer Part#: |
ATS-15G-18-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-18-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that help maintain a safe operating temperature for heat-sensitive components. ATS-15G-18-C1-R0 is a type of heat sink. In this article, we will look into its application field and working principle.
Application Field
The ATS-15G-18-C1-R0 is a thermal heat sink specially designed for applications where heat transfer needs to be accomplished without the use of a fan or other active cooling device. This heat sink uses a combination of thermal conduction, natural convection, and forced convection to transfer heat away from the heat source. It is most useful in applications that require part or all of the circuit board to be cooled, but there are also applications for smaller power dissipators such as transistors, MOSFETs, and other electronic components.
The ATS-15G-18-C1-R0 is designed to fit into a 0.65” x 0.75” footprint and provide 0.18” of thermal resistance with a free air open drive board design. It is applicable for high-power LED and semiconductor applications including smart lighting solutions and circuit board assembly applications. This heat sink is a good choice for applications in consumer electronics, automotive, and telecommunications.
Working Principle
The ATS-15G-18-C1-R0 uses a combination of thermal conduction, natural convection, and forced convection to transfer heat away from the heat source. Thermal conduction is used to cool the component by drawing heat away from it via a heat conducting material, such as aluminum or copper, which is then spread over the surface of the heat sink. Natural convection is the result of air being heated by the COB LED and creating a convection current of hot air being drawn up and away from the component. Forced convection, on the other hand, is created by using a fan or other active cooling device to help create a stronger convection current.
The ATS-15G-18-C1-R0 also uses angled fins to create turbulence as air flows across the heat sink, increasing the thermal exchange rate and maximizing heat dissipation. Additionally, the heat sink’s flat bottom ensures good contact between the heat sink and the COB LED for efficient heat transfer. The ATS-15G-18-C1-R0’s design and high quality components ensure efficient heat dissipation, making it an ideal choice for high power applications.
Conclusion
The ATS-15G-18-C1-R0 is a thermal heat sink that can be used in a variety of applications including consumer electronics, automotive, and telecommunications. It uses a combination of thermal conduction, natural convection, and forced convection to transfer heat away from the heat source. The ATS-15G-18-C1-R0’s design and high quality components ensure efficient heat dissipation, making it an ideal choice for high power applications.
The specific data is subject to PDF, and the above content is for reference