| Allicdata Part #: | ATS-15G-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-15G-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of many engineering processes. Heat transfer is a very common phenomenon, and thermal products such as heat sinks, cooling fans, and heat exchangers are all used to control the temperature of an object or environment. Heat sinks are particularly useful in helping to dissipate heat away from sensitive components or assemblies. The ATS-15G-181-C3-R0 is a product from Advanced Thermal Solutions (ATS) that specializes in thermal management solutions.
As its name implies, the ATS-15G-181-C3-R0 is a heat sink with a 15-gram, 1.81 cm cube design. It is a single, finned-block aluminum heat sink that has a natural anodized finish and self-adhesive thermal pad. The pad helps to improve thermal conductivity between the heat sink and the target object. The heat sink is designed to provide efficient thermal dissipation, preventing sensitive components from overheating. It is a simple but effective heat sink solution that is suitable for a wide range of applications.
The ATS-15G-181-C3-R0 is primarily used in applications where the thermal dissipation of a small component or assembly must be improved. It is often used in electronics such as computers and printed circuit boards, as well as in larger electronic systems and systems with multiple components. It can also be used as a replacement for larger, standard heat sinks in some applications. It is also well-suited to applications in robotics, telecommunications, automotive, and medical equipment.
The working principle of the ATS-15G-181-C3-R0 is relatively simple. It works to absorb the heat from the component or assembly it is attached to and then transfer it away from the component. The thermal pad helps with this, by improving heat transfer between the heat sink and the component. The heat is then dissipated through the fins via convection, which is the transfer of heat through the movement of air or other fluid. This process helps to keep the component or assembly cool and prevent overheating, allowing them to perform at optimal levels.
In summary, the ATS-15G-181-C3-R0 is a simple yet effective heat sink solution that can be used in a variety of applications. It is designed to provide efficient thermal dissipation, helping to protect sensitive components or assemblies from overexposure. The simple working principle is based on allowing heat to transfer between the component and the heat sink, before being dissipated effectively via convection. For these reasons, it is an ideal choice for many thermal management requirements.
The specific data is subject to PDF, and the above content is for reference