ATS-15G-189-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS26112-ND

Manufacturer Part#:

ATS-15G-189-C2-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15G-189-C2-R0 datasheetATS-15G-189-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.25880
10 +: $ 4.14099
25 +: $ 3.91079
50 +: $ 3.68084
100 +: $ 3.45076
250 +: $ 3.22071
500 +: $ 2.99066
1000 +: $ 2.93315
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.74°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an essential component in most electronic and electro-mechanical devices. They are used to passively dissipate thermal energy produced by components to ensure proper operation and prevent overheating. Heat sinks are available in a variety of designs and materials, depending on the application, and manufacturers produce customized solutions for specific needs.

The ATS-15G-189-C2-R0 is a heat sink designed and manufactured by Alpha Thermal Solutions, Inc., a US-based company. The product is designed for applications that require high heat dissipation and improved air flow. It is marketed as a medium-sized, aluminum heat sink capable of dissipating large amounts of heat.

The ATS-15G-189-C2-R0 is constructed from extruded aluminum and features an anodized finish. It is designed with a large base area for heat dissipation and features combination mounting holes for securing the heat sink to a variety of substrates. It also features four curved fins that increase surface area for improved air flow. This heat sink is well-suited for applications with high thermal loads.

The working principle of the ATS-15G-189-C2-R0 is based on natural convection. The cooling mechanism involves the transfer of thermal energy from the source component to the heat sink via thermal conduction. The thermal energy is then dissipated by air flowing up against the fins of the heat sink, which are designed to increase available surface area for improved air flow. The designed airflow helps to ensure efficient thermal management.

The ATS-15G-189-C2-R0 can be used in a variety of applications, including enclosures, power supplies, LEDs, computing, and electric and battery operated devices. Additionally, it is suitable for various industries such as automotive, medical, military, and telecommunications. Its strong thermal performance, combined with its compact size and anodized finish, makes it a suitable heat sink solution for mid- to high-power applications.

The ATS-15G-189-C2-R0 is an effective heat sink solution that offers high heat dissipation and improved airflow. It is designed for applications that require high thermal load dissipation and can be used in a variety of industries. Additionally, its anodized finish makes it a suitable choice for many types of applications.

The specific data is subject to PDF, and the above content is for reference

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