ATS-15G-23-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15G-23-C3-R0-ND

Manufacturer Part#:

ATS-15G-23-C3-R0

Price: $ 5.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15G-23-C3-R0 datasheetATS-15G-23-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.60341
30 +: $ 4.34784
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 1000Can Ship Immediately
$ 5.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management in various applications is critical in ensuring the prolonged viability and reliable operation of the components and systems contained therein. The ATS-15G-23-C3-R0 is a heat sink product that is used to manage excess thermal energy produced by electrically powered components. In this article, the application field and principles of operation of the ATS-15G-23-C3-R0 will be covered.

The ATS-15G-23-C3-R0 is a heat sink intended for use in confined spaces and low-profile applications, such as in the cooling of integrated circuits, LED lighting systems and other small components that generate heat. In such cases, the sink is used to draw the excess thermal energy away from the subject component which is being cooled and disperse it elsewhere. This helps to reduce the subject component’s temperatures, so that it can operate below its rated temperature for extended periods of time.

The ATS-15G-23-C3-R0 consists of a single aluminum heat sink piece that has been extruded and formed into a rectangular design, and is suitable for surface mounting. The structure has a total of 15 individual thermally conductive fins emanating from the center, with 23 cooling louvers running along each side. The fins have been given an anodized coating for increased durability, as well as being equipped with an integral Snap-ON retention clip for secure and reliable surface mount installation. The heat sink is suitable for applications with an ambient temperature range of -20°C to +102°C.

In terms of operation, the ATS-15G-23-C3-R0 is designed to work by gathering thermal energy from the source component and convert it into another form of energy. Heat energy is gathered from the source, then transferred via the defined structure of the ATS-15G-23-C3-R0 into its conductive fins and louvers and then dissipated away from the component source. The fins and louvers help to maximize the dissipation of thermal energy and create a larger area of contact between the heat sink and ambient air to maximize the effectiveness of the device.

The device is also equipped with four mounting screw holes for easy attachment. When mounting the ATS-15G-23-C3-R0, it is important to ensure that it is mounted parallel to the surface of the component to which it is attached in order to obtain maximum heat transfer efficiency. It is further advisable that the distance between the ATS-15G-23-C3-R0 and the source component is kept to a minimum in order to maximize the integrated thermal performance.

Overall, the ATS-15G-23-C3-R0 is an effective and efficient thermal management product that is specially designed for closed space and low-profile applications. The device is made of durable aluminum material and produces an increased surface area, and is simple to install and maintain. It is designed to draw the excess thermal energy away from the subject component which is being cooled and disperse it elsewhere. With the ATS-15G-23-C3-R0, reliable operation and prolonged viability can be ensured.

The specific data is subject to PDF, and the above content is for reference

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