ATS-15G-24-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15G-24-C3-R0-ND

Manufacturer Part#:

ATS-15G-24-C3-R0

Price: $ 5.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15G-24-C3-R0 datasheetATS-15G-24-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.85793
30 +: $ 4.58808
50 +: $ 4.31827
100 +: $ 4.04838
250 +: $ 3.77849
500 +: $ 3.50860
1000 +: $ 3.44112
Stock 1000Can Ship Immediately
$ 5.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.43°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are used to cool power devices, such as computer processors and graphics cards. Heat sinks dissipate heat from devices by dissipating the direct contact heat transfer from the power device into the surrounding atmosphere. The ATS-15G-24-C3-R0 is a thermal - heat sink designed to provide effective heat dissipation while maintaining a low profile.

ATS-15G-24-C3-R0 Application Field

The ATS-15G-24-C3-R0 heat sink is designed for air-cooled high-power applications where improved power levels, increased contact forces, or both are desired. These applications include input/output systems, power supplies, power amplifiers, and power converters that require high contact forces and/or restrictive internal space limitations.

The ATS-15G-24-C3-R0 features an innovative low profile design with optimized thermal performance. This heat sink utilizes six evenly spaced fins, each with three tiers and a unique angled cut pattern. This allows the ATS-15G-24-C3-R0 to provide an improved contact force while maintaining an effective thermal performance.

Additionally, the improved contact force allows the ATS-15G-24-C3-R0 to provide increased power dissipation for a given device. This allows for greater cooling even with the same device mounted in a device with internal space limitations.

ATS-15G-24-C3-R0 Working Principle

The ATS-15G-24-C3-R0 heat sink utilizes conduction as its primary heat transfer mechanism. Conduction is the thermal transfer of energy through a material caused by differences in temperatures between the two points. As the power device generates heat, it is transferred into the heat sink. The fins of the ATS-15G-24-C3-R0 then dissipate this heat into the surrounding atmosphere.

The ATS-15G-24-C3-R0 also utilizes convection, which is the transfer of heat energy caused by the large-scale motion of air. As air is drawn in around the heat sink, the heat dissipated from the fins is transferred away from the device.

Finally, radiation is also used by the ATS-15G-24-C3-R0. Radiation is the transfer of energy caused by electromagnetic waves emitted by a hot object. As the heated fins on the ATS-15G-24-C3-R0 emit electromagnetic waves, heat is transferred to the surrounding environment.

Conclusion

The ATS-15G-24-C3-R0 thermal – heat sink is an excellent choice for air-cooled high-power applications. Its low profile design allows it to fit into the internal space restrictions of some components while still providing an effective thermal performance. Additionally, its unique angled cut pattern provides improved contact forces and higher power dissipation than traditional heat sinks.

Finally, the ATS-15G-24-C3-R0 utilizes conduction, convection, and radiation to efficiently transfer heat away from power devices. This effective combination of thermal transfer mechanisms makes the ATS-15G-24-C3-R0 an ideal choice for high-power applications in limited-space environments.

The specific data is subject to PDF, and the above content is for reference

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