| Allicdata Part #: | ATS-15G-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-15G-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15G-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been an important factor in the electronic industry, as thermally intensive products require efficient heat dissipation solutions. Heat sinks are devices that dissipate heat from its source by providing a surface area from which the heat can be rapidly dissipated or transferred to the atmosphere. Heat sinks come in different designs, shapes, materials and sizes, and the ATS-15G-32-C2-R0 is one of such designs.
The ATS-15G-32-C2-R0 is a high-performance, low-profile heat sink and thermal transfer solution, designed to dissipate up to 32 watts of energy. It has a rugged and reliable design for extended operation in high-temperature environments, while also providing superior heat spreading performance. The major components of the ATS-15G-32-C2-R0 include an extruded aluminum fin section, a folded aluminum plate, and a large copper-zinc alloy C2-R0 base. The fin section has a single row of fin-shaped protrusions that allow air to flow evenly around the source, while the folded aluminum plate works with the C2-R0 base to absorb and dissipate heat even further.
The ATS-15G-32-C2-R0 is a versatile solution for a variety of applications, particularly in industries where power dissipation is critical. Its rugged design and dependable performance make it a great choice for efficient heat dissipation in the industrial, consumer, and telecommunications sectors. It can be used to cool components such as, power modules, microprocessors, power terminals, communication systems, and main boards. Its low-profile design also makes it suitable for use in space-restricted areas, such as small embedded systems.
The ATS-15G-32-C2-R0 is designed to be a low-cost, durable, and reliable thermal solution. Its low profile design makes it ideal for use in devices that require tight mounting requirements. Its aluminum fin and copper-zinc alloy C2-R0 base work together to provide effective heat transfer away from the source and into the atmosphere. With its wide range of capabilities, the ATS-15G-32-C2-R0 is an excellent choice for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference