ATS-15H-100-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are increasingly becoming integrated components of modern electronics. As systems become smaller, more efficient, and more power-dense, thermal management becomes an important challenge. The ATS-15H-100-C1-R0 heat sink from Advanced Thermal Solutions is a passive thermoelectric cooling solution to help dissipate heat from enclosed electronics systems. In this article, we will look at the application field and working principle of the ATS-15H-100-C1-R0 heat sink.

The ATS-15H-100-C1-R0 heat sink is designed to efficiently cool enclosed systems by dissipating heat away. It is primarily designed for use with residential and commercial electronics applications such as routers, switches, servers, and storage devices, but can also be used to dissipate heat from other electronic systems such as medical equipment, military electronics, and avionics. It is particularly well-suited for embedded systems and other applications that require space concision. This heat sink is an ideal cooling device for many different types of applications.

The ATS-15H-100-C1-R0 heat sink is made of an aluminum metal matrix composite material, which is a strong, lightweight material that provides excellent thermal conductivity. The material also provides good resistance to corrosion and abrasion. The heat sink also features a durable anodizing surface which offers greater thermal performance by increasing surface contact by trapping air between the aluminum surface and the electronics being cooled.

The ATS-15H-100-C1-R0 heat sink works on the principle of conduction. Heat is transferred from the electronic system through the heat sink to the surrounding air. Heat is also distributed outward from the heat sink by convection, radiating outward and then cooling down the system. The heat sink also features an enhanced convection chamber which improves airflow over the heat sink and helps to increase the cooling performance of the system.

The ATS-15H-100-C1-R0 heat sink is designed to be mounted onto a flat surface such as the top or bottom of a chassis. It features a number of mounting holes on its base, allowing it to be easily attached to the flat surface. The heat sink also has a built-in heat pipe which increases the surface area and allows for more efficient heat mass transportation. It should be noted, however, that the heat pipe should not be used to mount the heat sink as it could damage the component.

Overall, the ATS-15H-100-C1-R0 heat sink from Advanced Thermal Solutions is a high-performance passive thermoelectric cooling solution that can efficiently cool enclosed systems. It is especially well-suited for embedded electronics and other applications where space is constrained. With its strong, lightweight material, durable anodizing surface, and enhanced convection chamber, the heat sink can provide efficient heat dissipation and improved thermal performance.

The specific data is subject to PDF, and the above content is for reference