| Allicdata Part #: | ATS-15H-119-C3-R0-ND |
| Manufacturer Part#: |
ATS-15H-119-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-119-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-15H-119-C3-R0 is a thermal - heat sink device that is used to manage heat generated by electronic devices. It is designed to help optimize the performance and increase the longevity of the device it is applied to. The ATS-15H-119-C3-R0 delivers a strong, reliable heat dissipation, ensuring that the device will be able to operate effectively and efficiently.
The ATS-15H-119-C3-R0 has two primary components: the core and the fins. The core is the main heat sink. It is constructed from aluminum alloy, and it is designed to transfer thermal energy away from the device. The fin arrays are attached to the core and are used to increase the surface area of the device. This allows for increased heat dissipation into the surrounding air, thus reducing the temperature of the device.
In order to work, the ATS-15H-119-C3-R0 requires a heat source. This could be located inside or outside of the device. This could be the processor, the graphics card, or any other digital component. The heat source must be connected to the thermal-heat sink device, and the necessary power connections should also be made. Once the heat source is in place and the power connections are done, the cooling process can begin.
The cooling process begins when the energy generated by the heat source is conducted to the heat sink’s core. The heat is then spread to the fins. The heat is then dissipated into the atmosphere. This process is referred to as convection and is an effective way of removing heat from a device.
The ATS-15H-119-C3-R0 can be used in a variety of applications including, but not limited to, servers, laptops, and gaming consoles. Its performance can be further enhanced by adding a fan or other cooling device. This will help increase the airflow to the fins and allow the thermal-heat sink device to operate more effectively.
The ATS-15H-119-C3-R0 has a wide range of advantages. It is easy to use and install, offers good performance, and provides strong thermal dissipation. In addition, it is resistant to corrosion and can be used in a variety of environments. The device can also be used to cool multiple devices at the same time, making it a cost-effective solution for multi-device heating problems.
In conclusion, the ATS-15H-119-C3-R0 is an effective thermal-heat sink solution that can be used to manage heat generated by electronic devices. It has a strong, reliable construction, offers good performance, and is resistant to corrosion. This makes it a great choice for anyone looking for an effective, economical solution for cooling their device.
The specific data is subject to PDF, and the above content is for reference