ATS-15H-12-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-15H-12-C3-R0-ND

Manufacturer Part#:

ATS-15H-12-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-15H-12-C3-R0 datasheetATS-15H-12-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management and heat conduction is an important aspect in many different industries. From the manufacture of electronics, to automotive, aerospace and the medical industry, the ability to keep components cool is always a challenge. Heat sinks are used in applications where excessive heat needs to be dissipated. This can be achieved through the use of specialty materials, such as the ATS-15H-12-C3-R0.

The ATS-15H-12-C3-R0 is a high-performance, cost effective heat sink designed to offer superior thermal performance compared to traditional models. It is uniquely designed to offer superior thermal transfer characteristics, enabling it to handle higher power, with lower temperatures and higher efficiency. It is optimized for cooling multiple components, in many cases offering larger surface area than traditional heat sinks, as well as superior thermal conduction materials.

The ATS-15H-12-C3-R0 is a common choice for applications such as LED lighting, thermal management systems, and even in computer applications such as CPU, memory and chip sets. Its superior thermal conductivity is ideal for high power, high load operations, while the integrated heat dissipation fin helps to further spread the heat quickly. This helps it to function in high load and high temperature situations without sacrificing performance.

The ATS-15H-12-C3-R0 is constructed from aluminum-silicone bronze which offers excellent thermal conductivity. Unlike traditional heat sinks which are usually constructed from copper or even steel, the ATS-15H-12-C3-R0 is designed to be lightweight, yet strong and durable for long-term use. It also features a black anodized finish which is resistant to corrosion and helps maintain the heat sink’s thermal characteristics.

The ATS-15H-12-C3-R0’s working principle is based on the transfer of heat through the use of convection, conduction, and radiation. It works by absorbing thermal energy from the hot component, transferring the energy to the heat sink via convection and conduction, and then dissipating the energy through radiation. This ensures that the heat generated by the component is efficiently dispersed by the heat sink.

In addition to its superior thermal management abilities, the ATS-15H-12-C3-R0 also offers a number of additional features which make it an ideal choice for many applications. It is highly durable, corrosion resistant, and designed to be easy to install. It also offers a replaceable pin array which makes it simple to customize for enhanced heat dissipation.

The ATS-15H-12-C3-R0 from Advanced Thermal Solutions is an ideal choice for applications which require superior thermal transfer capabilities. This specialized heat sink can efficiently manage higher powered components, while still offering exceptional reliability and performance. Its unique design, superior materials, and enhanced features make it a great choice for anyone looking for a reliable thermal solution.

The specific data is subject to PDF, and the above content is for reference

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