| Allicdata Part #: | ATS-15H-132-C1-R0-ND |
| Manufacturer Part#: |
ATS-15H-132-C1-R0 |
| Price: | $ 4.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-132-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.93246 |
| 30 +: | $ 3.71427 |
| 50 +: | $ 3.49574 |
| 100 +: | $ 3.27726 |
| 250 +: | $ 3.05878 |
| 500 +: | $ 2.84029 |
| 1000 +: | $ 2.78567 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-15H-132-C1-R0 is a thermal - heat sink that is used in many applications. It is designed to efficiently dissipate heat generated by electronic components. This device can be used in many different applications such as data centers, telecommunications systems, automotive electronics, and many other applications where heat must be dissipated.
Application Field
The most typical application field for ATS-15H-132-C1-R0 is data centers. Heat sinks are essential components in data centers as they help to dissipate the thermal load produced by servers, switches, and other electronic components. ATS-15H-132-C1-R0 is a particularly effective heat sink for data centers as it is designed to be highly efficient at dissipating heat, keeping the components within the data center operating at safe temperatures.
The ATS-15H-132-C1-R0 is also increasingly being used in the telecommunications industry. This heat sink is ideal for dissipating the high amounts of heat produced by radio towers, base stations, and other radio communication equipment. Furthermore, ATS-15H-132-C1-R0 is an excellent choice for dissipating the large amounts of heat generated by automotive electronics, as the device is designed to handle large thermal loads.
Working Principle
The working principle of the ATS-15H-132-C1-R0 is quite simple. Heat is transferred from the electronic components to the heat sink via conduction. The heat is then dissipated from the heat sink thanks to its highly efficient air-flow design. The device is designed to effectively dissipate heat from the components, while at the same time keeping the components operating temperatures at safe levels.
The ATS-15H-132-C1-R0 features a finned heat sink design which helps to maximize air-flow and thus the efficiency of the heat dissipation. The fins dispersed across the surface of the device also help to increase the amount of surface area which leads to an increased rate of heat transfer. The fins also help to ensure that heat is dispersed evenly across the surface of the heat sink.
Conclusion
The ATS-15H-132-C1-R0 is a thermal - heat sink that is used in many applications where dissipating a large amount of heat is necessary. This device is commonly used in data center, telecommunications, and automotive applications. The ATS-15H-132-C1-R0 is designed with an efficient finned heat sink design that is designed to effectively dissipate heat while at the same time maintaining safe temperature levels.
The specific data is subject to PDF, and the above content is for reference