| Allicdata Part #: | ATS26256-ND |
| Manufacturer Part#: |
ATS-15H-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components for successful electrical and electronic systems, and the ATS-15H-14-C2-R0 heat sink is no exception. Principal among these components are the heat-sinking systems employed to dissipate heat generated by the system’s operational components. Since these heat-sinks dissipate heat at the point where it is generated, power-loss and efficiency are maintained while electrical device malfunctions caused by overheating are avoided.
The ATS-15H-14-C2-R0 specifically is designed for implementation into a system’s cooling system only. The thermal behavior of the heat sink depends primarily on minimal gas/air flow outside the system as well as the difference between the system’s power consumption at the point of installation and the thermal conductor’s surface temperature.
This specific model offers an integrated and cost-effective approach to designing an efficient and low-maintenance thermal cooling system. It is offers a high fin to baseplate Ratio of 14 to 1, and optimized heat dissipation surface that has been designed to allow for maximum heat removal with minimal height.
In order to achieve the desired efficiency, and properly dissipate the heat generated by the system’s operational components, the ATS-15H-14-C2-R0 utilizes the thermocouple principle. Also known as “Thermo-electric Cooling”, this principle utilizes two dissimilar metals that are bonded together at one end while the other end is exposed to the heat generated by the system’s operational component. A strong electric current is then pumped through these metals, causing electrons to move from the hot end to the cold end, generating a “cooling” effect known as the Peltier Effect.
This amazing principle has been effectively demonstrated in the ATS-15H-14-C2-R0, and is capable of reducing up to 25 percent of the entire system’s temperature. This heat sink also provides the user with a wide variety of options when selecting the most suitable mounting system for their device or application. The product includes six integral heat fins, all of which have been designed to seamlessly fit most standard forms of electronic component packages.
The ATS-15H-14-C2-R0 is an extraordinary example of a modern heat sink, specifically designed to efficiently dissipate heat at the point where it is generated. It features an integrated design comprising of a highly efficient thermoelectric cooler and perfected aerodynamics to provide maximum cooling performance with minimal height and weight.
The specific data is subject to PDF, and the above content is for reference