| Allicdata Part #: | ATS-15H-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-15H-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are designed to dissipate the heat from dynamic components such as CPUs and GPUs. The ATS-15H-145-C1-R0 is a heat sink that is designed for fanless thermal solutions. It is a robust and reliable solution for CPU, GPU, system on chip (SoC), diode, FET, electronic control unit (ECU), and memory applications. This heat sink is suitable for automotive, aerospace, and defense applications.
Design and Construction
The ATS-15H-145-C1-R0 is made of high quality aluminum alloy for better heat dissipation. The aluminum alloy used is 6061-T6 for greater durability and thermal performance. The heat sink has a height of 15.9 mm, a width of 145 mm, and a length of 44.5 mm. It also comes with a clip-on fan bracket for mounting a fan for applications that require additional cooling.
Working Principle
The thermal performance of the heat sink is dependent on its design and construction. The type of fin design and the number of fins used will determine the thermal performance. The ATS-15H-145-C1-R0 heatsink utilizes a special copper-fins design, which allows for efficient thermal transfer from the component to the heat sink fins. The fins also have a high surface area which allows for increased air flow, which allows for more efficient heat dissipation.
Applications
The ATS-15H-145-C1-R0 heat sink is suitable for high-performance applications due to its efficient thermal performance. It is commonly used in computers, servers, industrial systems, and network equipment, where reliable and efficient thermal management is needed. It is also used in automotive applications, particularly for electronic control units, as it is designed for shock and vibration resistance. It is also suitable for aerospace and defense applications due to its robust design and reliable thermal performance.
Conclusion
The ATS-15H-145-C1-R0 heat sink is an ideal solution for high-performance applications. It is a robust and reliable solution for CPUs, GPUs, SoCs, diodes, FETs, ECUs, and memory applications. It also suitable for automotive, aerospace, and defense applications due to its shock and vibration resistance. Furthermore, the aluminum alloy construction and copper-fins design provides excellent thermal performance, making it a great choice for efficient thermal management.
The specific data is subject to PDF, and the above content is for reference