| Allicdata Part #: | ATS26307-ND |
| Manufacturer Part#: |
ATS-15H-186-C2-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-186-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.20840 |
| 10 +: | $ 4.09437 |
| 25 +: | $ 3.86719 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.80°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is essential for high performance applications. Heat generated within the electronic components can cause serious damage and system failure if not properly dissipated. Heat sinks are an important tool for dissipating unwanted heat generated by electronic components. ATS-15H-186-C2-R0 is a heat sink that is designed to provide efficient thermal management for high-end electronic applications.
The ATS-15H-186-C2-R0 is a type of heat sink designed for extremely high thermal performance applications. It features a high-density fin array to ensure efficient heat dissipation. The fins are made from a high-thermal conductivity material such as copper or aluminum. The fin array is also designed to provide efficient natural convection airflow for high performance cooling. The heat sink also features an integrated thermal interface material which helps maximize thermal conductivity and performance.
The ATS-15H-186-C2-R0 is suitable for a wide range of electronic components that generate high amounts of heat, such as CPUs, GPUs, and high power processors. It is also designed for systems that require extreme cooling capabilities. The advanced heat dissipating features of the ATS-15H-186-C2-R0 allow for more efficient thermal management in extreme applications, such as servers, gaming systems, and other high-performance applications.
The ATS-15H-186-C2-R0 also features a robust construction. It is composed of sturdy aluminum alloy as well as high-quality components for reliable thermal performance. The heat sink also features an improved mounting system for easier installation. Additionally, the heat sink is EMI protected, which helps minimize electromagnetic interference.
The ATS-15H-186-C2-R0 is designed to provide superior thermal performance for high-end electronic applications. It has a robust construction and features an integrated thermal interface material for maximum thermal conductivity. The high-density fin array helps provide efficient cooling, while the improved mounting system makes installation easier. This heat sink is suitable for various high-performance components, including CPUs, GPUs, and high power processors. It is also EMI protected, which helps prevent electromagnetic interference.
The specific data is subject to PDF, and the above content is for reference