| Allicdata Part #: | ATS26313-ND |
| Manufacturer Part#: |
ATS-15H-191-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-191-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management device designed to transfer, or dissipate, heat away from a source such as an integrated circuit, computer, electronic device, or other forms of heat-generating electrical components. The ATS-15H-191-C2-R0 is a type of heat sink designed for efficient cooling.
The ATS-15H-191-C2-R0 consists of a base made from aluminum alloy, which is then machined to create the mounting flange for the integrated circuit. It also features an integrated thermally conductive heat dissipating element, which is designed with vertical fins to increase the surface area and promote heat dissipation. The fins are precision engineered to match the airflow of the fan that is mounted to the heat sink, further increasing the efficiency of the thermal solution.
The ATS-15H-191-C2-R0 is designed to work in combination with a fan to cool an electronic component. The fan creates airflow across the surface of the heat sink fin and helps to dissipate heat away from the source component. The heat is dissipated into the environment, which helps to maintain the temperature of the component. The combination of the fan and the heat sink fins means that they can be used in a variety of applications and increase the effectiveness of the thermal management solution.
The ATS-15H-191-C2-R0 is ideal for applications that require a compact form factor, fast cooling time, and superior thermal management performance. The thermally conductive material and increased fin size improve the overall performance of the heat sink. It is also compatible with many fan models and is suited for applications where a reliable and efficient cooling solution is needed.
The ATS-15H-191-C2-R0 is an excellent choice for a variety of thermal management applications. It is designed to efficiently dissipate heat away from an integrated circuit or other device. The increased fin size and thermally conductive material also promote efficient cooling. It is suitable for use in a variety of environments as it can be combined with a fan to create an effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference