| Allicdata Part #: | ATS-15H-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-15H-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-15H-197-C3-R0 thermal heat sink is a high-performance, cost-effective component used for efficiently transferring and dissipating heat from a variety of components in a variety of applications. It offers excellent thermal performance with low thermal resistance in a robust, lightweight package that makes it suitable for a wide variety of applications.
An ATS-15H-197-C3-R0 thermal heat sink is made up of a thin, lightweight body, and uses a specially designed extruded fin which is designed to offer superior heat dissipation characteristics. The fins are specially designed to be tightly packed together and be of the highest possible quality to maximize the transfer of heat from the component to the ambient environment. The body of the heat sink is also designed to be highly efficient in the transfer of heat from the surface, allowing for a lower overall thermal resistance.
The ATS-15H-197-C3-R0 thermal heat sink works by transferring heat away from the treated component and releasing it into the surrounding atmosphere. This is done by creating a thermal resistance path between the component and the heatsink, forcing the heat to move through the fins of the heat sink. The fins are designed for maximum efficiency, allowing for the heat to spread quickly and effectively, without causing any excessive temperatures. This not only reduces the thermal resistance, but also ensures that the temperatures of the components have a lower chance of exceeding their operational limits.
The ATS-15H-197-C3-R0 thermal heat sink is suitable for use in a wide range of applications, such as automotive electronics, embedded systems, and consumer electronics. Its robust construction, lightweight design, and excellent thermal performance make it well suited for use in these environments. Furthermore, it is equipped with a range of mounting options, allowing for easy integration into a variety of product designs. This makes it a versatile thermal management solution, suited for a variety of applications.
The ATS-15H-197-C3-R0 thermal heat sink is an ideal solution for effectively dissipating and transferring heat away from components to prevent them from reaching their operational limits. Its combination of lightweight construction, superior thermal performance, and versatile mounting options make it suitable for use in a variety of applications. It is an efficient, cost-effective component that helps to ensure that components remain within their safe operating temperature limits and performs consistently and reliably.
The specific data is subject to PDF, and the above content is for reference