| Allicdata Part #: | ATS-15H-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-15H-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential pieces of hardware that help regulate, dissipate, and draw away heat from the components of a system. The ATS-15H-200-C3-R0 heat sink is a prime example of such a product, with its wide-ranging applications and superior performance.
The ATS-15H-200 is designed with a unique shape, allowing it to work best with devices that have a high power and heat output. It has an extruded aluminum body, along with a finned base, that helps draw away heat from any component it comes in contact with. In addition, the heat sink is designed to be lightweight to save space in tight areas and has low thermal resistance, allowing it to remain cool with minimal effort.
The ATS-15H-200-C3-R0 heat sink is commonly used in a variety of electronics and devices, such as audio amplifiers, home theater equipment, optical storage devices, computer components, and mobile devices. Additionally, it can also be used in circuit boards to help cool hotspots and improve overall efficiency in the system. This type of heat sink is good for cooling high-power and high-heat devices due to its strong thermal resistance and lightweight design.
The working principle of the ATS-15H-200-C3-R0 heat sink is based on basic thermodynamics. Heat from the device is transferred to the metal fins of the heat sink through conduction. As the heat is transferred to the metal fins, it is then dispersed into the surrounding air. This process is aided by the fan that is integrated into the device. The fan helps to increase and maintain air flow, further spreading the heat away from the device.
The ATS-15H-200-C3-R0 heat sink is an effective way to keep your devices and components cool in tight spaces. With its lightweight design, low thermal resistance, and the ability to effectively disperse heat, it is an excellent choice for any application where large, heavy-duty heat sinks are not an option. Its wide-ranging applicability and superior performance make it an attractive choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference