| Allicdata Part #: | ATS26325-ND |
| Manufacturer Part#: |
ATS-15H-202-C2-R0 |
| Price: | $ 4.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-202-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.76740 |
| 10 +: | $ 3.66660 |
| 25 +: | $ 3.46298 |
| 50 +: | $ 3.25924 |
| 100 +: | $ 3.05556 |
| 250 +: | $ 2.85186 |
| 500 +: | $ 2.64816 |
| 1000 +: | $ 2.59723 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.83°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in a variety of applications and the use of heat sinks is critical for proper thermal management. The ATS-15H-202-C2-R0 heat sink is one such device that is used to improve the heat dissipation of electronic components.
The ATS-15H-202-C2-R0 is a type of fan-cooled, active-cooled heat sink. It is designed to keep electronic components at the optimal operating temperature by dissipating heat generated from the component’s internal operation. This heat sink utilizes an aluminium alloy frame and heatsink fins in order to efficiently dissipate the generated heat.
In order to ensure an effective amount of thermal management, the design of the ATS-15H-202-C2-R0 includes a built-in fan. This fan is used to ensure adequate airflow around the heatsink, thus promoting better heat dissipation. In addition, a fan guard is included to reduce noise levels.
The ATS-15H-202-C2-R0 has been designed to meet a wide range of applications such as specifically designed cooling systems for telecom appliances, control equipment and other electronic devices. It is also suitable for various embedded and automotive systems such as those based on Intel’s Core i7 processors, third generation mobile chipsets and Nvidia Tegra 4 devices. In addition, it is also used for gaming computers and other high-performance industrial applications.
The ATS-15H-202-C2-R0’s working principle is based on the principle of convection heat transfer. The heat generated from the electronic component is transferred to the surrounding air and removed by the fan. This heat transfer is more important in applications where the component is densely packed with other components and is limited in terms of space for cooling. As the heat sink can be positioned in more extreme locations within these dense environments, it can operate more effectively and efficiently.
The ATS-15H-202-C2-R0 also features a variety of mounting options depending on the application. It can be mounted to a flat surface or clamped into place. Additionally, it can be mounted horizontally or vertically to accommodate different component orientations. It also features a thermal interface material that allows for improved heat transfer between the heat sink and the component itself.
In summary, the ATS-15H-202-C2-R0 is an effective and efficient heat sink for a variety of applications. It utilizes convective heat transfer to efficiently dissipate heat and utilises a built-in fan for adequate airflow. Its versatile design makes it suitable for a wide range of applications from automotive systems to gaming computers. It is an essential component for proper thermal management.
The specific data is subject to PDF, and the above content is for reference