| Allicdata Part #: | ATS-15H-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-15H-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-15H-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks: ATS-15H-48-C3-R0 Application Field and Working Principle
Heat sinks are thermal management solutions typically used to dissipate the heat generated by electronic components in computer systems and other electronic equipment. The heat sink offered by ATS-15H-48-C3-R0 is specially manufactured and designed for use in a variety of applications where a high-performance heat sink is necessary to effectively dissipate heat. In this article, we\'ll discuss the application field and working principle of ATS-15H-48-C3-R0.
ATS-15H-48-C3-R0 is designed for high-performance applications and provides thermal resistance for better thermal performance. The ATS-15H-48-C3-R0 heat sink has a unique design that combines a low-profile extruded heat sink with a wide array of fins. The fins provide extra surface area for heat dissipation while the low-profile design ensures that this heat sink takes up less space than traditional heat sinks. The design also allows for larger volumes of air to be passed over the fins, helping to improve the heat dissipation performance.
The ATS-15H-48-C3-R0 heat sink is designed to be used in a wide variety of applications. It can be used in power supplies, LED drivers, processors, motor drivers, hard disks, and many other types of electronic devices. It is also suitable for consumer electronics such as computers, mobile phones, and TVs. This heat sink is suitable for both active and passive cooling. Passive cooling is often preferred over active cooling due to its cost and ease of installation.
The working principle of the ATS-15H-48-C3-R0 heat sink is based on the laws of thermodynamics. Basically, the heat from the device is transferred to the heat sink, which dissipates the heat into the surrounding environment. The heat sink is thus able to dissipate heat more effectively than the device itself. The fins on the heat sink help to maximize the transfer of heat energy by increasing the surface area available for conduction.
ATS-15H-48-C3-R0 is designed to be an efficient and reliable way to manage the heat generated by electronic components. Its unique design allows for a low-profile form factor and good thermal performance. The heat sink is suitable for a variety of applications and in combination with air convection, is an effective and efficient way to manage heat. This heat sink is a reliable thermal management solution and can be installed easily with minimal effort.
The specific data is subject to PDF, and the above content is for reference
ATS-15H-48-C3-R0 Datasheet/PDF