| Allicdata Part #: | ATS26365-ND |
| Manufacturer Part#: |
ATS-15H-64-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-64-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal – Heat Sinks
ATS-15H-64-C2-R0 Application Field and Working Principle
Thermal heat sinks are a type of cooling component that uses the heat dissipating properties of metal or other materials to dissipate heat from a device. ATS-15H-64-C2-R0 is a specific type of thermal heat sink application that is designed for high power applications. It is made from heavy-duty aluminum with a black/gold anodized finish. The thermal conductivity of this aluminum alloy is higher than that of standard aluminum, making it an ideal choice for high power applications.
Structure
ATS-15H-64-C2-R0 consists of a fin structure that has a combination of straight and curved fins with interconnecting channels to maximize surface area. This increases the amount of heat that can be dissipated effectively. The fin structure is then mounted onto an aluminum heat sink base. The base is an aluminum extrusion that is held in place with screws.
Working Principle
Thermal heat sinks are designed to dissipate heat from devices by the process of convection. Convection is simply the transfer of heat from a hot object to a cooler object. The fin design of ATS-15H-64-C2-R0 increases the surface area of the heat sink, which increases the amount of heat that can be dissipated. As air passes over the fins, it absorbs the heat and carries it away from the source. The heat is then dissipated by convection into the surrounding atmosphere. This allows the device to operate cooler and more efficiently.
Capability and Applications
The ATS-15H-64-C2-R0 is designed for high power applications, such as CPUs, power supplies, and telecommunication devices. It is capable of dissipating up to 15W of heat and will perform equally well in both air and liquid cooling systems. It is an ideal choice for high power applications because of its high thermal conductivity and its ability to dissipate heat quickly and efficiently.
Conclusion
The ATS-15H-64-C2-R0 thermal heat sink is an ideal choice for high power applications. Its fin structure and aluminum base provide increased surface area and greater thermal conductivity, allowing it to dissipate heat quickly and efficiently. It is capable of dissipating up to 15W of heat, making it perfect for high power applications such as CPUs, power supplies, and telecommunication devices.
The specific data is subject to PDF, and the above content is for reference