| Allicdata Part #: | ATS-15H-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-15H-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction: Thermal - Heat Sinks are one of the most common heat transfer devices used in various industries. The ATS-15H-73-C1-R0 is a thermal-heat sink device designed to dissipate heat from electric components like power transistors, microprocessors, and other heat generating components. This device is used to efficiently dissipate large amounts of heat, while still providing excellent cooling performance.
Application Field: The ATS-15H-73-C1-R0 thermal-heat sink is designed for high performance applications in demanding industrial and medical environments. It is designed for applications ranging from 100W to 350Watt (DCS) and is an excellent choice for both consumer and commercial applications. It is often paired with the ATS-15H-74-C1-R0 shroud to enhance cooling capabilities in high power applications. Additionally, the ATS-15H-73-C1-R0 has a unique design which allows it to be used in a variety of applications, including medical, automotive, and military.
Construction and Working Principle: The ATS-15H-73-C1-R0 is made from copper/aluminum construction, with a thin-film thermal contact area coated with Conductive Polymer Thermal Interface Material (CPTIM). This design requires no additional mounting hardware and is designed to provide optimal thermal transfer. The CPTIM is designed to provide improved contact area and improved thermal conduction. The ATS-15H-73-C1-R0 device features a staggered layout of fins which help to reduce turbulence and increase surface-area contact. The fins also create forced convection which helps to dissipate heat more efficiently. This design also helps to increase pressure drop through the device, which helps to maximize heat transfer from the heat-generating component. The device also features a flat bottom and is made from durable CM-13 grade aluminum alloy. This device is designed to withstand temperatures up to 125°C.
Installation and Maintenance: The ATS-15H-73-C1-R0 is designed to be easily installed by an individual user without the use of extra tools. The device features pre-applied adhesive on the underside of the fins and requires no additional mounting hardware. After installation, the device should be inspected periodically for changes in performance. It is important to ensure that the device is not subject to damage, as this can have a negative impact on the performance of the device. If necessary, the device should be replaced when performance begins to degrade.
Conclusion: The ATS-15H-73-C1-R0 thermal-heat sink is a widely used device in various industrial and medical applications. This device is designed to provide optimal thermal performance, while still providing excellent cooling performance. It is designed to withstand temperatures up to 125°C and is constructed from durable CM-13 grade aluminum alloy. This device is easy to install, requiring no additional mounting hardware, and can be inspected and replaced as necessary for ongoing performance.
The specific data is subject to PDF, and the above content is for reference